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FDT459N

Onsemi

FDT459N by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; No. of Elements: 1; Minimum DS Breakdown Voltage: 30 V;

Median Price

$0.576

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 437,493 parts In-Stock

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Rochester

USA . 8,538 parts In-Stock

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-

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$0.555

1k+ parts

$0.461

10k+ parts

$0.411

8,538

-

$0.555

$0.461

$0.411

DigiKey

USA . 8,538 parts In-Stock

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$0.690

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8,538

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$0.690

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Verical

USA . 7,415 parts In-Stock

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$0.576

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$0.513

7,415

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$0.576

$0.513

Distributors (In-Stock)

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Digiode

USA . 716 parts In-Stock

1+ parts

$0.432

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$0.432

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Vyrian

USA . 865 parts In-Stock

1+ parts

$0.455

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865

$0.455

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Component Electronics Inc.

Canada . 7 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

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7

$0.770

$0.580

$0.500

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DigiKey Marketplace

USA . 437,493 parts In-Stock

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437,493

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Flip Electronics

USA . 433,493 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,410 parts In-Stock

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2,410

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Ashlea Components Ltd

UK . 1,876 parts In-Stock

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1,876

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ComSIT Distribution GmbH

Germany . 1,248 parts In-Stock

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Chip Stock

USA . 575 parts In-Stock

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575

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Bristol Electronics

USA . 129 parts In-Stock

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Sea View Technologies

USA . 119 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,822 parts In-Stock

1+ parts

$0.410

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$0.410

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Corohmni

South Africa . 332 parts In-Stock

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$0.455

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332

$0.455

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Andel Nordic

Denmark . 361 parts In-Stock

1+ parts

$5.005

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$4.805

10k+ parts

$4.805

361

$5.005

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$4.805

$4.805

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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Perfect Parts

USA . 27,749 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,085 parts In-Stock

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SupplyDigital Components

Austria . 8,224 parts In-Stock

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TANS Electronics

Latvia . 7,668 parts In-Stock

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Kulean Microsystems

USA . 6,306 parts In-Stock

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Problanco Electronics

Mexico . 5,600 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,410 parts In-Stock

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Supply Digital

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Native Components

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UHIMA Technologies

Türkiye . 300 parts In-Stock

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Northwest PG Solutions

USA . 39 parts In-Stock

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Technical Specifications

Power Field Effect Transistors (FET) FDT459N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

3 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDT459N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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