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FCH76N60N

Onsemi

FCH76N60N by Onsemi

FCH76N60N by Onsemi is a power FET with a min DS breakdown voltage of 600V. It has a max pulsed drain current of 228A and a max power dissipation of 543W. This transistor is commonly used for switching applications.

Median Price

$16.532

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Rochester

USA . 323 parts In-Stock

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$15.280

100+ parts

$14.360

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$12.990

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323

$15.280

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$12.990

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Farnell

UK . 863 parts In-Stock

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$16.532

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$12.842

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$12.212

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863

$16.532

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$12.212

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RS (Exports)

UK . 78 parts In-Stock

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$30.839

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Arrow

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Digiode

USA . 3,225 parts In-Stock

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$14.516

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Nova Conductors

Japan . 700 parts In-Stock

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Zilex Electronics Inc.

Canada . 347 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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Bristol Electronics

USA . 125 parts In-Stock

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Dan-Mar Components

USA . 125 parts In-Stock

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Vyrian

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Ashlea Components Ltd

UK . 60 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,288 parts In-Stock

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$0.678

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2,288

$0.678

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Continental Prestige Electronics

USA . 3,704 parts In-Stock

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$12.860

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$9.990

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3,704

$12.860

$9.990

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Semicontronic

India . 323 parts In-Stock

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$12.990

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$12.665

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$12.600

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323

$12.990

$12.665

$12.600

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Ampacity Inc.

Singapore . 305 parts In-Stock

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$12.990

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Corphita

USA . 2,578 parts In-Stock

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$13.752

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2,578

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Component Stockers USA

USA . 1,354 parts In-Stock

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$14.890

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$14.000

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$12.660

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1,354

$14.890

$14.000

$12.660

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Corohmni

South Africa . 268 parts In-Stock

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$15.130

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268

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Microchip USA

USA . 7,360 parts In-Stock

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$53.015

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7,360

$53.015

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Lixinc

USA . 11,486 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,374 parts In-Stock

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Problanco Electronics

Mexico . 8,088 parts In-Stock

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SupplyDigital Components

Austria . 4,578 parts In-Stock

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Kulean Microsystems

USA . 4,162 parts In-Stock

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TANS Electronics

Latvia . 3,539 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,016 parts In-Stock

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Kepictronics

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Ashlea Components Ltd (Excess)

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Perfect Parts

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Authorized Procurement Solutions

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Supply Digital

USA . 616 parts In-Stock

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UHIMA Technologies

Türkiye . 345 parts In-Stock

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Argo Parts USA

USA . 261 parts In-Stock

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Bastille Electronics

Australia . 73 parts In-Stock

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Overview

Discover the power of the FCH76N60N by Onsemi, a high-quality Power Field Effect Transistor (FET) that offers unmatched performance and reliability. With its N-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Its impressive 600V minimum DS breakdown voltage ensures safe and efficient operation. The FCH76N60N's single terminal form and rectangular package shape make installation a breeze. Experience the benefits of its enhancement mode and maximize efficiency in your projects. Whether you're designing power supplies or motor controls, this transistor is the ultimate choice. Trust Onsemi, a leading manufacturer known for delivering exceptional products. Get yours today and unlock the limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This choice of material ensures durability and protection for the Power Field Effect Transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

The N-CHANNEL configuration allows for efficient control of current flow, making this Power Field Effect Transistor suitable for applications requiring high-performance switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this Power Field Effect Transistor simplifies circuit design, providing cost-effective and space-saving solutions for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power Field Effect Transistor ensures efficient and reliable performance, contributing to overall system efficiency.

Minimum DS Breakdown Voltage: 600 V

With a high minimum DS (Drain-Source) Breakdown Voltage, this Power Field Effect Transistor can handle high voltage situations, making it suitable for a wide range of applications requiring robust performance.

Package Shape: RECTANGULAR

The rectangular package shape of this Power Field Effect Transistor allows for easy integration into various circuit layouts, providing flexibility and convenience during installation.

Terminal Form: THROUGH-HOLE

Featuring through-hole terminals, this Power Field Effect Transistor ensures secure connections, enhancing the overall reliability and longevity of the system.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation of this Power Field Effect Transistor ensures efficient control over current flow, enabling precise switching capabilities and improved system performance.

No. of Elements: 1

With a single element, this Power Field Effect Transistor simplifies circuit design and reduces complexity, making it a cost-effective choice for various applications.

Maximum Pulsed Drain Current (IDM): 228 A

With a high maximum pulsed drain current capacity, this Power Field Effect Transistor can handle surge currents, making it suitable for applications where high power transients occur.

Avalanche Energy Rating (EAS): 8022 mJ

The high avalanche energy rating of this Power Field Effect Transistor ensures robustness and protection against voltage spikes, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 76 A

With a maximum drain current capacity of 76 A, this Power Field Effect Transistor can handle high currents, allowing for efficient power flow in various applications.

No. of Terminals: 3

With three terminals, this Power Field Effect Transistor provides straightforward connectivity and ease of use, simplifying circuit designs and reducing installation time.

Maximum Power Dissipation (Abs): 543 W

The high maximum power dissipation capability of this Power Field Effect Transistor ensures efficient heat dissipation, enabling reliable operation in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style of this Power Field Effect Transistor allows for secure and stable mounting, enhancing the overall mechanical stability of the system.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using metal-oxide semiconductor technology, this Power Field Effect Transistor offers low power consumption, high switching speed, and excellent overall performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this Power Field Effect Transistor can withstand high-temperature environments, providing reliability in demanding applications.

Transistor Element Material: SILICON

Made of silicon, this Power Field Effect Transistor offers superior performance characteristics, such as high breakdown voltage, low on-resistance, and reliable switching behavior.

Terminal Finish: MATTE TIN

The matte tin terminal finish of this Power Field Effect Transistor ensures excellent solderability and resistance against corrosion, enhancing the overall reliability and lifespan of the device.

Maximum Drain-Source On Resistance: 0.036 ohm

With a low maximum drain-source on resistance, this Power Field Effect Transistor minimizes power losses and improves efficiency, making it an ideal choice for high-performance applications.

Terminal Position: SINGLE

Featuring a single terminal position, this Power Field Effect Transistor simplifies circuit design and enhances ease of use, providing convenience during installation and maintenance.

Technical Specifications

Power Field Effect Transistors (FET) FCH76N60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

8022 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

228 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCH76N60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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