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FAN7171MX-F085P

Onsemi

FAN7171MX-F085P by Onsemi

FAN7171MX-F085P by Onsemi is an AEC-Q100 compliant MOSFET gate driver with 8 terminals, small outline package, and gull wing terminal form. It operates b/w -40 to 125°C, has a supply voltage of 15V, and features turn-on/off times of 25/15 us. Ideal for automotive applications requiring high side drivers in compact designs.

Median Price

$1.501

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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IBS Electronics

USA . 12,500 parts In-Stock

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$1.501

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$1.353

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$1.248

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$1.501

$1.353

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$1.248

Vyrian

USA . 5,624 parts In-Stock

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Digiode

USA . 2,466 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 669 parts In-Stock

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$4.500

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669

$4.500

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Semicontronic

India . 905 parts In-Stock

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$7.500

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$7.312

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$7.275

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905

$7.500

$7.312

$7.275

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Aztec Data Supply Inc.

USA . 717 parts In-Stock

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$7.810

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$7.810

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AZTECH Wire

Italy . 598 parts In-Stock

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$8.714

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598

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Kulean Microsystems

USA . 6,365 parts In-Stock

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SupplyDigital Components

Austria . 5,778 parts In-Stock

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TANS Electronics

Latvia . 5,714 parts In-Stock

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Microchip USA

USA . 4,878 parts In-Stock

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Problanco Electronics

Mexico . 4,288 parts In-Stock

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Continental Prestige Electronics

USA . 3,770 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,618 parts In-Stock

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Argo Parts USA

USA . 864 parts In-Stock

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Corohmni

South Africa . 354 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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77

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Bastille Electronics

Australia . 45 parts In-Stock

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Overview

Experience the superior performance of the FAN7171MX-F085P MOSFET Gate Driver from Onsemi, a trusted manufacturer known for their high-quality components. Ideal for automotive applications, this surface-mount driver offers reliability and efficiency with a wide operating temperature range. With a compact package design and fast response times, this gate driver provides value and benefits to customers looking for seamless operation and optimal power management. Upgrade your designs with the FAN7171MX-F085P and experience the difference in performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this product suitable for automotive applications.

No. of Terminals: 8

8 terminals provide connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes this product suitable for demanding environments.

Width: 3.9 mm

Compact width allows for space-saving design and integration in tight spaces.

High Side Driver: YES

High side driver capability allows for control of power MOSFETs in automotive and industrial applications.

Turn-on Time: 25 us

Fast turn-on time ensures quick response and efficient operation of the MOSFET driver.

Technical Specifications

MOSFET Gate Drivers FAN7171MX-F085P attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

.1 mA

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

15 us

Turn-on Time:

25 us

Width:

3.9 mm

Trade Compliance

FAN7171MX-F085P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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