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FAN54511APUCX

Onsemi

FAN54511APUCX by Onsemi

FAN54511APUCX by Onsemi is a Power Management IC with 63 terminals in a grid array package. It has a max supply voltage of 13.25V and adjustable threshold feature. This IC type is suitable for power supply support circuits, offering very thin profile and fine pitch for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,589 parts In-Stock

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Digiode

USA . 322 parts In-Stock

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322

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Distributors (Availability)

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Microchip USA

USA . 4,849 parts In-Stock

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$14.367

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4,849

$14.367

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AZTECH Wire

Italy . 768 parts In-Stock

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$20.160

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768

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Native Components

USA . 82 parts In-Stock

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$53.630

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$51.485

82

$53.630

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$51.485

Northwest PG Solutions

USA . 606 parts In-Stock

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$58.993

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606

$58.993

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TANS Electronics

Latvia . 6,170 parts In-Stock

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6,170

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SupplyDigital Components

Austria . 5,700 parts In-Stock

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5,700

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Problanco Electronics

Mexico . 5,127 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 1,852 parts In-Stock

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Kulean Microsystems

USA . 1,320 parts In-Stock

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Corohmni

South Africa . 274 parts In-Stock

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UHIMA Technologies

Türkiye . 126 parts In-Stock

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Overview

Unlock the power of precise power management with the FAN54511APUCX by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that provide exceptional performance and reliability. Perfect for a wide range of applications, this innovative product offers customers the value of efficient power supply support circuitry, adjustable threshold, and a maximum supply voltage of 13.25 V. Experience the benefits of superior technology and seamless integration with the FAN54511APUCX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and thermal stability, making the product durable for long-term use.

Surface Mount: YES

Easily mountable on a PCB, saving space and making installation easier.

Package Shape: RECTANGULAR

Efficient use of space on the PCB, maximizing component density.

No. of Terminals: 63

Provides high functionality and connectivity options for various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-performance power management with a compact design.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Facilitates easier PCB mounting and maintenance.

Maximum Seated Height: 0.526 mm

Low profile design saves space and allows for compact device designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring stable and efficient power management.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly for reliable performance.

Peak Reflow Temperature °C: 260

Tolerates high temperatures during the assembly process without compromising functionality.

Terminal Form: BALL

Allows for reliable and secure connections on the PCB.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable high density packaging and precise connections.

Maximum Supply Voltage (Vsup): 13.25 V

Supports a wide range of supply voltages, making it versatile for various applications.

Adjustable Threshold: YES

Allows for customization and optimization of power management settings based on specific requirements.

Technical Specifications

Power Management ICs FAN54511APUCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B63

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

63

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA63,9X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.526 mm

Maximum Supply Voltage (Vsup):

13.25 V

Surface Mount:

YES

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FAN54511APUCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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