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FAN54041UCX

Onsemi

FAN54041UCX by Onsemi

FAN54041UCX by Onsemi is a power management IC with a nominal voltage of 5V. It has a package style of grid array, very thin profile, and fine pitch. This IC is commonly used in industrial applications for power supply management circuits.

Median Price

$0.795

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.766

1k+ parts

$0.636

10k+ parts

$0.567

9,000

-

$0.766

$0.636

$0.567

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.800

10k+ parts

-

9,000

-

-

$0.800

-

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.795

10k+ parts

$0.709

9,000

-

-

$0.795

$0.709

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,359 parts In-Stock

1+ parts

$0.597

100+ parts

-

1k+ parts

-

10k+ parts

-

1,359

$0.597

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.606

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.606

-

-

-

DigiKey Marketplace

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Vyrian

USA . 8,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,637

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 1,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

-

-

-

-

Bristol Electronics

USA . 1,985 parts In-Stock

1+ parts

-

100+ parts

$1.055

1k+ parts

$0.591

10k+ parts

$0.557

1,985

-

$1.055

$0.591

$0.557

Dan-Mar Components

USA . 1,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,931 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

-

10k+ parts

-

8,931

$0.530

-

-

-

Semicontronic

India . 8,780 parts In-Stock

1+ parts

$0.530

100+ parts

$0.517

1k+ parts

$0.514

10k+ parts

-

8,780

$0.530

$0.517

$0.514

-

Corphita

USA . 225 parts In-Stock

1+ parts

$0.565

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$0.565

-

-

-

Corohmni

South Africa . 466 parts In-Stock

1+ parts

$0.594

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$0.594

-

-

-

Continental Prestige Electronics

USA . 5,080 parts In-Stock

1+ parts

$0.606

100+ parts

-

1k+ parts

-

10k+ parts

$0.594

5,080

$0.606

-

-

$0.594

Argo Parts USA

USA . 3,950 parts In-Stock

1+ parts

$0.606

100+ parts

-

1k+ parts

-

10k+ parts

$0.588

3,950

$0.606

-

-

$0.588

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.606

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$0.606

-

-

-

Aztec Data Supply Inc.

USA . 1,472 parts In-Stock

1+ parts

$21.328

100+ parts

-

1k+ parts

-

10k+ parts

-

1,472

$21.328

-

-

-

Perfect Parts

USA . 8,945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,945

-

-

-

-

Problanco Electronics

Mexico . 6,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,807

-

-

-

-

Kulean Microsystems

USA . 3,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,066

-

-

-

-

SupplyDigital Components

Austria . 2,437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,437

-

-

-

-

TANS Electronics

Latvia . 2,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,420

-

-

-

-

Supply Digital

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,987

-

-

-

-

Microchip USA

USA . 1,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,957

-

-

-

-

UHIMA Technologies

Türkiye . 573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

573

-

-

-

-

Overview

Discover the FAN54041UCX by Onsemi, a high-quality Power Management IC that offers unmatched performance and reliability. With its cutting-edge technology and robust design, this product is built to meet the demands of various applications. Whether you're looking for efficient power management solutions or superior thermal performance, the FAN54041UCX has got you covered. Its compact size and surface-mount capability make it ideal for space-constrained designs. Experience the value and benefits that Onsemi brings to the table with this exceptional product. Take your power management to new heights with the FAN54041UCX!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and resistance to various environmental factors, making it a reliable choice for power management ICs.

Surface Mount:

YES - The surface mount capability allows for easy and efficient installation, saving time and effort during manufacturing.

Package Shape:

RECTANGULAR - The rectangular shape provides compatibility with standard PCB designs, making integration seamless and straightforward.

Nominal Supply Voltage (Vsup):

5 V - With a stable nominal supply voltage, this power management IC ensures consistent and reliable operation within specified parameters.

Power Supplies (V):

5 - Supporting multiple power supplies, this IC is versatile and can cater to a range of applications and power requirements.

No. of Terminals:

25 - The abundance of terminals provides sufficient connectivity options and enhances connectivity flexibility for various power management applications.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array style, combined with a very thin profile and fine pitch, allows for efficient use of space on the PCB, optimizing the overall design.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this IC can withstand harsh operating conditions, ensuring reliability and longevity.

Minimum Operating Temperature:

40 °C - The wide temperature range allows for operation in extreme cold environments, expanding the applicability of this power management IC.

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu) - The terminal finish with tin, silver, and copper provides excellent conductivity, ensuring efficient power transfer and minimizing signal loss.

Terminal Position:

BOTTOM - The bottom terminal position simplifies PCB layout and reduces signal interference, leading to improved performance and overall reliability.

Maximum Seated Height:

0.625 mm - With a low maximum seated height, this IC takes up minimal space on the PCB, allowing for compact and slim designs.

Width (mm):

2 mm - The compact width facilitates integration into space-constrained applications, providing design flexibility and saving valuable board real estate.

Other IC type:

POWER SUPPLY MANAGEMENT CIRCUIT - As a specialized power supply management circuit, this IC offers dedicated functionality, ensuring optimized power management and improved overall system efficiency.

Minimum Supply Voltage (Vsup):

4 V - With a low minimum supply voltage, this IC can efficiently operate with low input power, promoting energy-saving capabilities.

Maximum Time At Peak Reflow Temperature (s):

30 - The IC's ability to withstand peak reflow temperature for a maximum of 30 seconds ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this IC is suitable for lead-free soldering processes, complying with industry standards and regulations.

Length:

2.4 mm - The compact length allows for easy integration into space-constrained designs, providing more flexibility in various applications.

Temperature Grade:

INDUSTRIAL - This IC is designed to meet industrial temperature standards, ensuring reliable operation in demanding environments.

Maximum Supply Current (Isup):

0.28 mA - With a low maximum supply current, this IC consumes minimal power, contributing to energy efficiency and prolonged battery life.

No. of Channels:

2 - The availability of two channels expands the IC's capabilities, allowing for independent power management for multiple devices or subsystems.

Terminal Form:

BALL - The ball terminal form enhances solder joint reliability, improving the overall robustness and longevity of the IC.

Terminal Pitch:

0.4 mm - The small terminal pitch enables high-density PCB designs, accommodating more components and enhancing overall functionality.

Maximum Supply Voltage (Vsup):

6 V - The high maximum supply voltage capability ensures compatibility with a wide range of power sources, making this IC suitable for diverse applications.

Adjustable Threshold:

YES - The ability to adjust the threshold allows for customization and fine-tuning of power management parameters, adapting to specific system requirements.

Technical Specifications

Power Management ICs FAN54041UCX attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B25

JESD-609 Code:

e1

Length:

2.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.28 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

FAN54041UCX Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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