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ESDR7534W1T2G

Onsemi

ESDR7534W1T2G by Onsemi

ESDR7534W1T2G by Onsemi is a single transient suppression device with 300W peak power dissipation. It operates b/w -55 to 125°C, with breakdown voltage of 6-9.5V. Ideal for protecting electronic circuits from ESD events per IEC-61000-4-2 standard.

Median Price

$0.262

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 69 parts In-Stock

1+ parts

$0.157

100+ parts

$0.143

1k+ parts

$0.129

10k+ parts

-

69

$0.157

$0.143

$0.129

-

Rochester

USA . 12,604,197 parts In-Stock

1+ parts

-

100+ parts

$0.272

1k+ parts

$0.225

10k+ parts

$0.201

12,604,197

-

$0.272

$0.225

$0.201

DigiKey

USA . 12,604,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.340

10k+ parts

-

12,604,197

-

-

$0.340

-

Verical

USA . 10,484,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.251

10,484,238

-

-

-

$0.251

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,212 parts In-Stock

1+ parts

$0.149

100+ parts

-

1k+ parts

-

10k+ parts

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1,212

$0.149

-

-

-

Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$0.203

100+ parts

-

1k+ parts

-

10k+ parts

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34

$0.203

-

-

-

DigiKey Marketplace

USA . 12,610,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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12,610,232

-

-

-

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Vyrian

USA . 8,925,166 parts In-Stock

1+ parts

-

100+ parts

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8,925,166

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-

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Chip Stock

USA . 66,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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66,000

-

-

-

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ComSIT Distribution GmbH

Germany . 901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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901

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 176 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

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176

$0.093

-

-

-

Ampacity Inc.

Singapore . 8,924,871 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

-

10k+ parts

-

8,924,871

$0.133

-

-

-

Corphita

USA . 919 parts In-Stock

1+ parts

$0.141

100+ parts

-

1k+ parts

-

10k+ parts

-

919

$0.141

-

-

-

Advanced Electronics

New Zealand . 69 parts In-Stock

1+ parts

$0.157

100+ parts

$0.143

1k+ parts

$0.129

10k+ parts

-

69

$0.157

$0.143

$0.129

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.203

100+ parts

-

1k+ parts

$0.193

10k+ parts

$0.189

50

$0.203

-

$0.193

$0.189

Component Stockers USA

USA . 16,838,439 parts In-Stock

1+ parts

$0.230

100+ parts

$0.220

1k+ parts

$0.200

10k+ parts

$0.200

16,838,439

$0.230

$0.220

$0.200

$0.200

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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25,000

-

-

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Kepictronics

USA . 7,050 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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7,050

-

-

-

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Kulean Microsystems

USA . 4,919 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,919

-

-

-

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Problanco Electronics

Mexico . 4,339 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,339

-

-

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SupplyDigital Components

Austria . 3,345 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,345

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-

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TANS Electronics

Latvia . 2,971 parts In-Stock

1+ parts

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100+ parts

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2,971

-

-

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A-Z Elektronik GmbH

Germany . 2,118 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,118

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-

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Alle Elektronik GmbH

Germany . 1,412 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,412

-

-

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UHIMA Technologies

Türkiye . 668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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668

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-

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Overview

Get ready to experience top-notch protection with the ESDR7534W1T2G by Onsemi. Designed by a trusted manufacturer, this transient suppression device offers unmatched quality and reliability. Perfect for a wide range of applications, this product provides value by safeguarding your electronics from damaging voltage spikes. With its high power dissipation capability and compact design, the ESDR7534W1T2G ensures peace of mind for your sensitive equipment. Upgrade to this cutting-edge technology today and enjoy the benefits of superior protection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the device, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and effort during assembly.

Maximum Non Repetitive Peak Reverse Power Dissipation: 300 W

With a high peak reverse power dissipation, this device can handle transient surges effectively, providing robust protection for sensitive electronics.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in challenging environments.

Minimum Breakdown Voltage: 6 V

The low minimum breakdown voltage allows for effective transient suppression at lower voltage levels, offering protection for a wider range of circuits.

Reference Standard: IEC-61000-4-2

Compliance with the IEC standard ensures that this device meets international quality and performance requirements.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diode technology offers fast response times and efficient transient suppression capabilities.

Technical Specifications

Transient Suppression Devices ESDR7534W1T2G attributes and parameters. Explore more Transient Suppression Devices devices from Onsemi

Specs

Additional Features:

LOW CAPACITANCE

Maximum Breakdown Voltage:

9.5 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

300 W

No. of Elements:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Reference Standard:

IEC-61000-4-2

Maximum Repetitive Peak Reverse Voltage:

5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ESDR7534W1T2G Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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