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CS9202YDFR8G

Onsemi

CS9202YDFR8G by Onsemi

CS9202YDFR8G by Onsemi is a fixed positive single output LDO regulator with 3.3V nominal output voltage and 0.1A max output current. It operates in temperatures ranging from -40 to 150 °C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,390 parts In-Stock

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Digiode

USA . 2,262 parts In-Stock

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AZTECH Wire

Italy . 134 parts In-Stock

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$12.710

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134

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TANS Electronics

Latvia . 7,818 parts In-Stock

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Kulean Microsystems

USA . 7,629 parts In-Stock

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Problanco Electronics

Mexico . 3,861 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Northwest PG Solutions

USA . 846 parts In-Stock

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$4.174

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Corphita

USA . 835 parts In-Stock

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835

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UHIMA Technologies

Türkiye . 695 parts In-Stock

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SupplyDigital Components

Austria . 694 parts In-Stock

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Corohmni

South Africa . 261 parts In-Stock

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Microchip USA

USA . 199 parts In-Stock

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Native Components

USA . 41 parts In-Stock

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Overview

Experience superior quality and reliability with the CS9202YDFR8G from Onsemi, a leading manufacturer in the industry. This fixed positive single output LDO regulator is perfect for a wide range of applications, providing stable and precise power regulation. With a nominal output voltage of 3.3V and maximum load regulation of 0.05%, this regulator offers unmatched performance and efficiency. Trust Onsemi to deliver cutting-edge technology and exceptional value with the CS9202YDFR8G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for easier integration into circuit boards, saving space and providing a more compact design.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature ensures stability and reliability even in harsh environments or under heavy loads.

Technology: BIPOLAR

Bipolar technology offers high accuracy and low noise, making this regulator suitable for precision applications.

Nominal Output Voltage-1: 3.3 V

Stable and precise output voltage of 3.3V ensures consistent power supply to connected components, reducing the risk of damage or malfunction.

Maximum Output Current-1: 0.1 A

Able to provide a maximum output current of 0.1A, making it suitable for low-power devices or applications that require minimal power consumption.

Technical Specifications

Fixed Regulators - Positive Single Output LDO CS9202YDFR8G attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1.2 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

26 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation:

.05 %

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3.9 mm

Trade Compliance

CS9202YDFR8G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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