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CS-2842ADW

Onsemi

CS-2842ADW by Onsemi

CS-2842ADW by Onsemi is a switching controller with current-mode control technique. It has a max output current of 1A and operates b/w -25 to 85 °C. Ideal for applications requiring efficient power management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 877 parts In-Stock

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877

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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150

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ComSIT USA

USA . 144 parts In-Stock

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144

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Vyrian

USA . 82 parts In-Stock

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82

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Distributors (Availability)

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Native Components

USA . 65 parts In-Stock

1+ parts

$599.650

100+ parts

$587.657

1k+ parts

$581.661

10k+ parts

$575.664

65

$599.650

$587.657

$581.661

$575.664

Northwest PG Solutions

USA . 1,399 parts In-Stock

1+ parts

$659.615

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1,399

$659.615

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SupplyDigital Components

Austria . 7,829 parts In-Stock

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7,829

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,725 parts In-Stock

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4,725

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Corphita

USA . 1,933 parts In-Stock

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1,933

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UHIMA Technologies

Türkiye . 607 parts In-Stock

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607

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TANS Electronics

Latvia . 333 parts In-Stock

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333

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Corohmni

South Africa . 221 parts In-Stock

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Kulean Microsystems

USA . 63 parts In-Stock

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63

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Elevate your electronic projects with the CS-2842ADW by Onsemi. As a leading manufacturer of Switching Regulators & Controllers, Onsemi brings you a versatile and reliable product that offers seamless integration and superior performance. With a wide range of applications in power management, this compact and efficient device provides exceptional value and benefits to customers. Experience the quality and precision of Onsemi's technology with the CS-2842ADW - your go-to solution for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and can withstand various environmental conditions, making the product reliable.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the PCB, optimizing space usage.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting various components, improving versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact design and reduces overall product size.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can perform reliably even in elevated temperature environments.

Control Mode: CURRENT-MODE

Current-mode control allows for precise regulation and efficient power conversion, enhancing performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead finish on terminals provides good conductivity and helps prevent oxidation, ensuring long-term usability.

Terminal Position: DUAL

Dual terminal position allows for easy connection and can accommodate various PCB layouts.

Maximum Seated Height: 2.65 mm

The low seated height helps in compact design and enables the product to fit in constrained spaces.

Width (mm): 7.5 mm

Having a width of 7.5mm makes the product suitable for applications where space is limited.

Other IC type: SWITCHING CONTROLLER

Switching controller IC type ensures efficient power conversion and precise control, improving overall performance.

Nominal Input Voltage: 15 V

The nominal input voltage of 15V is suitable for a wide range of applications, providing compatibility.

Length: 10.3 mm

The length of 10.3mm allows for compact design and efficient use of space on the PCB.

Maximum Output Current: 1 A

With a maximum output current of 1A, the product can deliver sufficient power for various applications.

Terminal Form: GULL WING

Gull wing terminal form ensures secure connections and ease of soldering, enhancing reliability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers precise control over the output voltage, improving efficiency and performance.

Switcher Config: SINGLE

Single switcher configuration simplifies design and enhances efficiency, making the product a cost-effective choice.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product is easy to integrate and suitable for high-density PCB designs.

Minimum Input Voltage: 12 V

The minimum input voltage of 12V ensures compatibility with a wide range of power sources.

Maximum Input Voltage: 25 V

The maximum input voltage of 25V provides flexibility in power supply options, making the product versatile.

Technical Specifications

Switching Regulators & Controllers CS-2842ADW attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

25 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

15 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Switcher Config:

SINGLE

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

CS-2842ADW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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