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CAT660EXA-TE13

Onsemi

CAT660EXA-TE13 by Onsemi

CAT660EXA-TE13 by Onsemi is a Switched Capacitor Converter with input voltage range of 1.5V to 5.5V, ideal for industrial applications. It operates b/w -40 °C to 85°C, in a small outline package measuring 4.9mm x 3.9mm with dual terminals and matte tin finish, suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 995 parts In-Stock

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995

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Digiode

USA . 89 parts In-Stock

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89

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 847 parts In-Stock

1+ parts

$0.405

100+ parts

-

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10k+ parts

$0.389

847

$0.405

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$0.389

Northwest PG Solutions

USA . 2,264 parts In-Stock

1+ parts

$0.446

100+ parts

-

1k+ parts

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10k+ parts

$0.393

2,264

$0.446

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$0.393

Kulean Microsystems

USA . 8,050 parts In-Stock

1+ parts

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8,050

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TANS Electronics

Latvia . 3,213 parts In-Stock

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3,213

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Problanco Electronics

Mexico . 2,159 parts In-Stock

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2,159

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Corphita

USA . 1,287 parts In-Stock

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1,287

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UHIMA Technologies

Türkiye . 598 parts In-Stock

1+ parts

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598

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SupplyDigital Components

Austria . 437 parts In-Stock

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437

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Corohmni

South Africa . 245 parts In-Stock

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245

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Overview

Experience the innovative power of the CAT660EXA-TE13 by Onsemi, a top-quality switching regulator & controller designed for various industrial applications. Manufactured by Onsemi, a trusted name in the industry, this product offers unmatched reliability and performance. With a compact design and wide temperature range, this product is perfect for demanding environments. Trust the CAT660EXA-TE13 to deliver efficient power management solutions that meet your needs with precision and excellence. Elevate your projects with this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the internal components of the switching regulator, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and space in the overall product design.

Package Shape: RECTANGULAR

Rectangular package shape is a standardized form factor that is easy to integrate into a variety of electronic applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in the connections and configurations of the switching regulator, allowing for customization based on specific requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enables the switching regulator to function efficiently in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and conductivity, ensuring reliable connections for optimal performance of the switching regulator.

Minimum Input Voltage: 1.5 V

The low minimum input voltage requirement of 1.5 V allows the switching regulator to operate effectively with a wide range of power sources, making it versatile for various applications.

Technical Specifications

Switching Regulators & Controllers CAT660EXA-TE13 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

DOUBLER INVERTER

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

CAT660EXA-TE13 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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