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CAT6219-125TDGT3

Onsemi

CAT6219-125TDGT3 by Onsemi

CAT6219-125TDGT3 by Onsemi is a Fixed Positive Single Output LDO Regulator with 1.25V output voltage, 0.5A max output current, and 0.5V dropout voltage. It is ideal for applications requiring stable power supply in compact spaces due to its small outline package and wide operating temperature range from -40 °C to 125°C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,951 parts In-Stock

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Kulean Microsystems

USA . 7,828 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 5,597 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 4,521 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 2,337 parts In-Stock

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SupplyDigital Components

Austria . 1,606 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,558 parts In-Stock

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Northwest PG Solutions

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Perfect Parts

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UHIMA Technologies

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Corohmni

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Microchip USA

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Overview

Experience premium quality and reliability with the CAT6219-125TDGT3 by Onsemi, a leading manufacturer in the industry. This fixed regulator offers exceptional performance in various applications, ensuring stable output voltage with minimal dropout. With a compact design and advanced technology, this LDO regulator is a game-changer in power management solutions. Trust Onsemi to deliver innovative products that provide value, efficiency, and superior performance to meet your needs. Choose the CAT6219-125TDGT3 for unparalleled benefits and advantages that set it apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a long lifespan for the product.

Maximum Dropout Voltage: 1.5 V

The low dropout voltage allows the regulator to operate efficiently even when the input voltage is close to the output voltage, making it suitable for low power applications.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand elevated temperatures without compromising performance, making it suitable for a wide range of operating conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making this regulator an energy-efficient choice for various applications.

Nominal Output Voltage: 1.25 V

The stable output voltage of 1.25V ensures consistent power supply to connected devices, making it ideal for powering sensitive electronics.

Maximum Output Current: 0.5 A

With a maximum output current of 0.5A, this regulator can provide sufficient power for a variety of applications, making it versatile and reliable.

Technical Specifications

Fixed Regulators - Positive Single Output LDO CAT6219-125TDGT3 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.5 V

Nominal Dropout Voltage-1:

.3 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Maximum Line Regulation:

.01625 %

Maximum Load Regulation:

.025 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Nominal Output Voltage-1:

1.25 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

2 %

Width:

1.6 mm

Trade Compliance

CAT6219-125TDGT3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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