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CAT6218-240TDGT3

Onsemi

CAT6218-240TDGT3 by Onsemi

CAT6218-240TDGT3 by Onsemi is a Fixed Positive Single Output LDO Regulator with 0.3A max output current, 2% voltage tolerance, and 1mm max seated height. Ideal for applications requiring a compact solution with precise voltage regulation in temperature-sensitive environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Prism Electronics

USA . 1,446 parts In-Stock

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Digiode

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Problanco Electronics

Mexico . 5,777 parts In-Stock

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TANS Electronics

Latvia . 3,671 parts In-Stock

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SupplyDigital Components

Austria . 3,189 parts In-Stock

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Northwest PG Solutions

USA . 2,260 parts In-Stock

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Kulean Microsystems

USA . 2,238 parts In-Stock

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Perfect Parts

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Corphita

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Native Components

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Microchip USA

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Overview

Unleash the power of the CAT6218-240TDGT3 by Onsemi, a top-of-the-line fixed regulator that guarantees superior quality and reliability. Manufactured by the renowned Onsemi brand, this product is designed to deliver outstanding performance in various applications. With its cutting-edge technology and precise engineering, this LDO regulator offers customers unparalleled value, benefits, and advantages. Say goodbye to voltage discrepancies and hello to seamless operations with the CAT6218-240TDGT3. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material makes this product durable and resistant to external elements, ensuring a longer lifespan.

Maximum Dropout Voltage-1: 1.3 V

Low dropout voltage ensures efficient power delivery and minimal power loss, making this regulator energy-efficient.

Surface Mount: YES

Being surface mountable, this regulator is easy to integrate into PCB designs, saving space and simplifying assembly.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this regulator can withstand demanding environmental conditions, ensuring reliable performance.

Nominal Output Voltage-1: 2.4 V

Having a stable nominal output voltage makes this regulator suitable for a wide range of applications that require a specific voltage level.

Maximum Output Current-1: 0.3 A

The high maximum output current capability allows this regulator to power various electronic devices efficiently and reliably.

Technical Specifications

Fixed Regulators - Positive Single Output LDO CAT6218-240TDGT3 attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.3 V

Nominal Dropout Voltage-1:

.18 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.3 V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2.9 mm

Maximum Line Regulation:

.0202 %

Maximum Load Regulation:

.036 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

2.448 V

Minimum Output Voltage-1:

2.352 V

Nominal Output Voltage-1:

2.4 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

2 %

Width:

1.6 mm

Trade Compliance

CAT6218-240TDGT3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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