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CAT6202VP2-GT3

Onsemi

CAT6202VP2-GT3 by Onsemi

CAT6202VP2-GT3 by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.5A and a max dropout voltage of 0.35V. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,312 parts In-Stock

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Digiode

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Native Components

USA . 707 parts In-Stock

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$0.102

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$0.098

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Northwest PG Solutions

USA . 648 parts In-Stock

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$0.112

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AZTECH Wire

Italy . 154 parts In-Stock

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$9.200

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Perfect Parts

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Problanco Electronics

Mexico . 7,269 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

Germany . 3,486 parts In-Stock

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Kulean Microsystems

USA . 2,560 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,324 parts In-Stock

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Corphita

USA . 1,623 parts In-Stock

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TANS Electronics

Latvia . 874 parts In-Stock

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SupplyDigital Components

Austria . 407 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 270 parts In-Stock

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Corohmni

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Overview

Unlock unparalleled power management capabilities with the CAT6202VP2-GT3 by Onsemi. Crafted with precision and reliability, this adjustable regulator offers cutting-edge technology in a compact package. Ideal for a wide range of applications, it guarantees optimal performance and efficiency. Trust Onsemi's expertise to deliver superior quality and unmatched value. Elevate your projects with the CAT6202VP2-GT3 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and helps in reducing the overall weight of the regulator.

Maximum Dropout Voltage-1: 1.35 V

Low dropout voltage ensures that the regulator can operate effectively even when the input voltage is close to the output voltage, making it suitable for low power applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and enabling automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range ensures stable performance in varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the regulator suitable for battery-powered devices.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy integration into electronic devices and provides a compact form factor.

No. of Terminals: 8

Sufficient number of terminals for connecting to external components and PCB, ensuring flexibility in design and functionality.

Maximum Line Regulation (%/V): 0.4

Low line regulation ensures stable output voltage despite variations in input voltage, enhancing reliability.

Adjustability: ADJUSTABLE

Ability to adjust the output voltage as per application requirements provides customization and versatility.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO CAT6202VP2-GT3 attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.35 V

Nominal Dropout Voltage-1:

.25 V

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Maximum Line Regulation (%/V):

.4

Maximum Load Regulation (%):

2.5 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

12.5 V

Minimum Output Voltage-1:

1.238 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

CAT6202VP2-GT3 Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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