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CAT5111VI-10-T3

Onsemi

CAT5111VI-10-T3 by Onsemi

CAT5111VI-10-T3 by Onsemi is a Digital Potentiometer with 10000 ohm resistance, 300 ppm/°C temp coefficient, and 20% resistance tolerance. Ideal for industrial applications due to its linear resistance law, INCREMENT/DECREMENT control interface, and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,541 parts In-Stock

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Digiode

USA . 1,817 parts In-Stock

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Native Components

USA . 354 parts In-Stock

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$0.047

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$0.045

354

$0.047

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$0.045

AZTECH Wire

Italy . 1,107 parts In-Stock

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$14.850

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$14.850

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Corohmni

South Africa . 200 parts In-Stock

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$23.924

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$23.924

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$30.115

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$27.405

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$24.694

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3,000

$30.115

$27.405

$24.694

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QUARKTWIN TECHNOLOGY LTD

USA . 12,623 parts In-Stock

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SupplyDigital Components

Austria . 8,139 parts In-Stock

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Microchip USA

USA . 6,520 parts In-Stock

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TANS Electronics

Latvia . 6,126 parts In-Stock

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Problanco Electronics

Mexico . 5,710 parts In-Stock

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Northwest PG Solutions

USA . 654 parts In-Stock

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UHIMA Technologies

Türkiye . 508 parts In-Stock

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Corphita

USA . 297 parts In-Stock

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Kulean Microsystems

USA . 157 parts In-Stock

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Overview

Enhance your electronic circuits with the CAT5111VI-10-T3 by Onsemi, a top-of-the-line digital potentiometer that promises unparalleled quality and reliability. Manufactured by industry leader Onsemi, this product offers precision control and versatile applications in a compact package. Whether you're designing consumer electronics or industrial machinery, this digital potentiometer delivers exceptional value, flexibility, and performance. Upgrade your projects today with the CAT5111VI-10-T3 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that is suitable for a variety of electronic applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and making it convenient for integration into electronic devices.

Nominal Temperature Coefficient: 300 ppm/°C

Stable performance over a wide temperature range, ensuring reliability in different operating conditions.

Package Shape: RECTANGULAR

Compact shape that allows for efficient placement on circuit boards.

Control Interface: INCREMENT/DECREMENT

Simple and intuitive control interface for adjusting resistance values.

Resistance Law: LINEAR

Provides a linear relationship between resistance setting and position, making it easy to achieve precise resistance values.

Nominal Total Resistance: 10000 ohm

Suitable for a wide range of applications that require adjustable resistance.

Maximum Resistor Terminal Voltage: 3 V

Safe operating voltage that prevents damage to the device.

No. of Terminals: 8

Sufficient terminals for connection in circuits and for control interface.

Package Style (Meter): SMALL OUTLINE

Space-efficient package style that allows for compact designs in electronic devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operational in low temperatures, providing versatility in various environments.

Terminal Finish: Tin (Sn)

Provides good electrical conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Two terminal positions for flexible connectivity options in circuits.

Maximum Seated Height: 1.75 mm

Low profile design for compact integration in electronic devices.

Maximum Resistance Tolerance: 20 %

Allows for some variation in resistance values without affecting overall performance.

Width: 3.9 mm

Compact width for easy placement on circuit boards.

No. of Positions: 100

Offers a wide range of resistance settings for flexibility in applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a short duration, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature for reliable soldering during assembly processes.

Length: 4.9 mm

Compact length for efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable performance.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering onto circuit boards.

Converter Type: DIGITAL POTENTIOMETER

Digital potentiometer for accurate and precise resistance adjustments.

Nominal Supply Voltage: 3 V

Compatible with common supply voltages for easy integration into electronic systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with various circuit board layouts.

Minimum Resistor Terminal Voltage: 0 V

Allows for a wide range of voltage inputs for versatile applications.

Technical Specifications

Digital Potentiometers (DigiPOT) CAT5111VI-10-T3 attributes and parameters. Explore more Digital Potentiometers (DigiPOT) devices from Onsemi

Converter Specifications

Technology:

CMOS

Resistance Law:

Linear

Nominal Total Resistance:

10 KΩ

Control Interface:

Increment/Decrement

No. of Functions:

1

Maximum Resistance Tolerance:

20 %

Additional Features:

Nonvolatile memory

Electrical Characteristics

Nominal Supply Voltage:

3 V

Minimum Resistor Terminal Voltage:

0 V

Maximum Resistor Terminal Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Nominal Temperature Coefficient:

300 ppm/°C

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

Terminal Form:

Terminal Position:

Dual

No. of Terminals:

8

Terminal Finish:

Tin

Terminal Pitch:

0.05 in (1.27 mm)

No. of Positions:

100

Maximum Seated Height:

0.069 in (1.75 mm)

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Packaging

Package Shape:

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Code:

SOP

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Trade Compliance

CAT5111VI-10-T3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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