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BBS3002-TL-1E

Onsemi

BBS3002-TL-1E by Onsemi

BBS3002-TL-1E by Onsemi is a P-channel Power FET with 60V DS breakdown voltage, 400A IDM, and 0.009 ohm max RDS(on). Ideal for power management applications due to its high drain current capacity and low on-resistance. Suitable for use in enhancement mode operation at up to 150°C operating temperature.

Median Price

$2.594

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 23 parts In-Stock

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$2.594

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Vyrian

USA . 8,994 parts In-Stock

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VNN

France . 4,487 parts In-Stock

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Digiode

USA . 441 parts In-Stock

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441

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Flip Electronics

USA . 80 parts In-Stock

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80

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Contempo Components LLC

USA . 5 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,442 parts In-Stock

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$1.205

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$1.205

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Continental Prestige Electronics

USA . 5,389 parts In-Stock

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$2.594

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$2.542

5,389

$2.594

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$2.542

Argo Parts USA

USA . 781 parts In-Stock

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$2.594

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781

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Netroflash

USA . 500 parts In-Stock

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$2.594

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500

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Semicontronic

India . 232 parts In-Stock

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$6.050

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$5.899

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$5.868

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232

$6.050

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Ampacity Inc.

Singapore . 1,289 parts In-Stock

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$9.050

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AZTECH Wire

Italy . 643 parts In-Stock

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$16.088

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Microchip USA

USA . 124 parts In-Stock

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$17.181

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Perfect Parts

USA . 37,457 parts In-Stock

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Lixinc

USA . 7,420 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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TANS Electronics

Latvia . 5,575 parts In-Stock

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Kulean Microsystems

USA . 3,975 parts In-Stock

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SupplyDigital Components

Austria . 3,279 parts In-Stock

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Kepictronics

USA . 2,687 parts In-Stock

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Corphita

USA . 2,180 parts In-Stock

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Robosynatics

Brazil . 975 parts In-Stock

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$0.377

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$0.377

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$0.377

975

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Lucentia Tech

USA . 975 parts In-Stock

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$0.377

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$0.377

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975

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UHIMA Technologies

Türkiye . 817 parts In-Stock

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Problanco Electronics

Mexico . 577 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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Overview

Experience the power and efficiency of the BBS3002-TL-1E by Onsemi, a top-quality Power Field Effect Transistor designed to meet your needs. With a single configuration and built-in diode, this P-Channel transistor offers reliability and performance in a compact package. Ideal for a range of applications, from automotive to industrial electronics, this transistor delivers maximum power dissipation and a low on-resistance for enhanced functionality. Trust in Onsemi's reputation for excellence and discover the value and benefits that the BBS3002-TL-1E can bring to your projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the internal components of the FET.

Polarity or Channel Type

P-CHANNEL - This type of transistor allows for efficient current flow in a specific direction, making it ideal for certain circuit designs.

Configuration

SINGLE WITH BUILT-IN DIODE - The built-in diode enhances the functionality of the transistor, making it versatile for various applications.

Surface Mount

YES - This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Minimum DS Breakdown Voltage

60 V - With a high breakdown voltage, this FET can handle higher voltage levels without malfunctioning.

Package Shape

RECTANGULAR - The rectangular shape makes it easy to place and secure the FET within a circuit layout.

Terminal Form

GULL WING - The gull wing terminals provide a reliable connection to the circuit board, ensuring stable performance.

Operating Mode

ENHANCEMENT MODE - This mode allows for efficient control of the transistor's conductivity, enabling precise power management.

Maximum Pulsed Drain Current (IDM)

400 A - The high pulsed drain current rating ensures the FET can handle sudden spikes in power without damage.

Avalanche Energy Rating (EAS)

340 mJ - The high avalanche energy rating indicates the FET's ability to withstand power surges without failure.

Maximum Drain Current (Abs) (ID)

100 A - A high drain current rating allows the FET to handle large electrical loads with ease.

No. of Terminals

2 - The simple two-terminal design simplifies installation and reduces the risk of connection errors.

Maximum Power Dissipation (Abs)

90 W - The high power dissipation rating ensures the FET can handle high levels of power without overheating.

Package Style (Meter)

SMALL OUTLINE - The compact small outline package saves space on the circuit board and allows for efficient use of available area.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - This advanced technology provides high performance and reliability in electronic circuits.

Maximum Operating Temperature

150 °C - The high operating temperature range allows the FET to function effectively in various environmental conditions.

Transistor Element Material

SILICON - Silicon material provides high conductivity and durability, ensuring long-term reliability of the FET.

Terminal Finish

MATTE TIN - The matte tin finish improves the terminal's conductivity and ensures a secure connection with the circuit board.

Maximum Drain-Source On Resistance

0.009 ohm - Low on-resistance ensures minimal power loss and efficient operation of the FET.

Terminal Position

SINGLE - The single terminal position simplifies installation and ensures proper alignment on the circuit board.

Case Connection

DRAIN - The drain connection design enables effective power flow and control in the circuit.

Maximum Time At Peak Reflow Temperature (s)

30 - The specified reflow time ensures proper soldering of the FET during assembly.

Peak Reflow Temperature °C

245 - The high peak reflow temperature ensures secure bonding of the FET onto the circuit board.

Maximum Feedback Capacitance (Crss)

950 pF - The low feedback capacitance minimizes signal distortion and enhances overall performance of the FET.

Technical Specifications

Power Field Effect Transistors (FET) BBS3002-TL-1E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

950 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

BBS3002-TL-1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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