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AR0230CSSC12SUEAH3-GEVB

Onsemi

AR0230CSSC12SUEAH3-GEVB by Onsemi

AR0230CSSC12SUEAH3-GEVB by Onsemi is an Image Sensor Evaluation Board with AR0230CS IC. It has MSL of 1, comes in Bulk packaging, and includes board(s). Ideal for evaluating image sensor performance in various applications like automotive cameras and surveillance systems.

Median Price

$312.500

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

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$312.500

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2

$312.500

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Distributors (In-Stock)

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Vyrian

USA . 6,665 parts In-Stock

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6,665

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Digiode

USA . 434 parts In-Stock

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434

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Distributors (Availability)

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AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$13.230

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339

$13.230

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SupplyDigital Components

Austria . 8,385 parts In-Stock

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8,385

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Problanco Electronics

Mexico . 5,407 parts In-Stock

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5,407

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Northwest PG Solutions

USA . 2,299 parts In-Stock

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2,299

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Corphita

USA . 1,152 parts In-Stock

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1,152

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TANS Electronics

Latvia . 1,030 parts In-Stock

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1,030

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Kulean Microsystems

USA . 667 parts In-Stock

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667

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UHIMA Technologies

Türkiye . 628 parts In-Stock

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628

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Native Components

USA . 534 parts In-Stock

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534

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Corohmni

South Africa . 395 parts In-Stock

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395

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Overview

Unlock the potential of your imaging projects with the AR0230CSSC12SUEAH3-GEVB from Onsemi, a trusted leader in semiconductor innovation. This advanced sensor evaluation board is designed to streamline development, delivering exceptional image quality for diverse applications, from automotive to security. Experience unmatched reliability and support that empowers you to bring your vision to life, enhancing both efficiency and performance while reducing time to market.

Feature Benefit Bullets

Category: Development Boards, Kits, Programmers / Evaluation Boards

This product belongs to a well-established category that facilitates development and prototyping, making it a versatile choice for engineers and developers.

Sensor Type: Image Sensor

The use of an image sensor allows for high-quality image processing applications, making this board suitable for various imaging projects.

Packaging: Bulk

Bulk packaging is beneficial for larger projects or multiple unit deployments, providing cost-effectiveness and convenience for developers.

Supplied Contents: Board(s)

The inclusion of the board(s) ensures that users have everything they need to start their projects immediately, enhancing the product's value.

Utilized IC / Part: AR0230CS

The AR0230CS chip is known for its performance in image processing, making this evaluation board a strong choice for high-quality sensor applications.

Base Product Number: AR0230

Having a clear base product number allows for easy identification and support for upgrades or compatible components.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With an MSL of 1, this product can be handled without restrictions related to moisture exposure, simplifying storage and assembly processes.

Technical Specifications

Additional Parts AR0230CSSC12SUEAH3-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0230CS

Standard Package:

1

Base Product Number:

AR0230

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0230CSSC12SUEAH3-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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