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AR0135CS2M00SUEAH3-GEVB

Onsemi

AR0135CS2M00SUEAH3-GEVB by Onsemi

AR0135CS2M00SUEAH3-GEVB by Onsemi is an Image Sensor Evaluation Board with AR0135CS IC. It comes in Bulk packaging and includes board(s). The sensor type is Image Sensor, base product number AR0135, MSL level 1. Ideal for evaluating image sensor performance in various applications.

Median Price

$312.500

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

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$312.500

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2

$312.500

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Distributors (In-Stock)

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Vyrian

USA . 4,202 parts In-Stock

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4,202

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Digiode

USA . 635 parts In-Stock

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635

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Distributors (Availability)

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Native Components

USA . 677 parts In-Stock

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$1.695

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677

$1.695

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Northwest PG Solutions

USA . 198 parts In-Stock

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$1.865

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198

$1.865

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AZTECH Wire

Italy . 209 parts In-Stock

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$22.220

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209

$22.220

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TANS Electronics

Latvia . 4,567 parts In-Stock

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Problanco Electronics

Mexico . 3,177 parts In-Stock

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Corphita

USA . 2,459 parts In-Stock

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2,459

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Kulean Microsystems

USA . 1,207 parts In-Stock

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UHIMA Technologies

Türkiye . 803 parts In-Stock

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803

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SupplyDigital Components

Austria . 529 parts In-Stock

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529

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Corohmni

South Africa . 158 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock the full potential of your imaging projects with the AR0135CS2M00SUEAH3-GEVB by Onsemi. This sensor evaluation board offers unparalleled quality and reliability, backed by the trusted name of Onsemi. Perfect for development boards, kits, and programmers, this product provides a seamless experience for capturing high-quality images. Whether you're working on automotive applications or security systems, this board delivers exceptional performance and value to meet all your needs. Elevate your projects today with the AR0135CS2M00SUEAH3-GEVB.

Feature Benefit Bullets

Sensor Type: Image Sensor

This product includes an image sensor, allowing for high-quality image capture and processing capabilities.

Supplied Contents: Board(s)

The product comes with board(s) included, providing all the necessary components for evaluation and testing.

Utilized IC / Part: AR0135CS

The use of AR0135CS IC enhances the performance and functionality of the product, ensuring reliable operation.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

With a moisture sensitivity level of 1, this product can be stored and used in various environments without risk of damage from moisture exposure.

Technical Specifications

Additional Parts AR0135CS2M00SUEAH3-GEVB attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Sensor Evaluation Boards

Sensor Type:

Image Sensor

Supplied Contents:

Board(s)

Packaging:

Bulk

Utilized IC / Part:

AR0135CS

Standard Package:

1

Base Product Number:

AR0135

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

AR0135CS2M00SUEAH3-GEVB Miscellaneous Components trade compliance attributes, and parameters.

HTS

0000.00.0000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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