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ALP327

Onsemi

ALP327 by Onsemi

ALP327 by Onsemi is a 881x228 pixel display with dimensions of 75x60x2 mm. It operates b/w -10 °C to 60°C, making it suitable for various applications requiring a compact and high-resolution display such as portable devices and IoT gadgets.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

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2,473

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Vyrian

USA . 95 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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95

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 283 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

-

10k+ parts

$0.136

283

$0.142

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-

$0.136

Northwest PG Solutions

USA . 42 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

$0.138

42

$0.156

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$0.138

SupplyDigital Components

Austria . 8,139 parts In-Stock

1+ parts

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8,139

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TANS Electronics

Latvia . 7,895 parts In-Stock

1+ parts

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7,895

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Kulean Microsystems

USA . 4,156 parts In-Stock

1+ parts

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4,156

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Problanco Electronics

Mexico . 1,755 parts In-Stock

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1,755

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Corphita

USA . 1,424 parts In-Stock

1+ parts

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100+ parts

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1,424

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UHIMA Technologies

Türkiye . 245 parts In-Stock

1+ parts

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245

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Corohmni

South Africa . 60 parts In-Stock

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60

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Overview

Enhance your viewing experience with the ALP327 by Onsemi. As a leader in display technology, Onsemi brings you a high-quality product that boasts crisp images and vibrant colors. Perfect for a wide range of applications, from digital signage to medical equipment, this display monitor offers unmatched value and performance. Elevate your visuals with the ALP327 and see the difference for yourself.

Feature Benefit Bullets

Horizontal Pixel Count: 881 Pixel

High resolution display provides sharp and detailed images for a superior viewing experience.

Depth: 2 mm

Ultra-thin design saves space and gives a sleek look to the monitor.

Maximum Operating Temperature: 60 °C

Wide temperature range ensures the monitor can function efficiently in various environments.

Height: 60 mm

Compact size allows for easy placement in any workspace.

Minimum Operating Temperature: -10 °C

Can operate in colder temperatures without risk of damage.

Viewing Area Length: 71 mm

Optimal viewing area size ensures a comfortable viewing experience.

Length: 75 mm

Compact overall size takes up minimal space on a desk or mounting surface.

Viewing Area Height: 53 mm

Sufficient height for viewing content without straining the eyes.

Pixel Count (Vertical): 228 Pixel

Combined with high horizontal pixel count, offers excellent picture quality and clarity.

Technical Specifications

Displays & Monitors ALP327 attributes and parameters. Explore more Displays & Monitors devices from Onsemi

Specs

Horizontal Pixel Count:

881 Pixel

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-10 Cel

Depth:

2 mm

Height:

60 mm

Length:

75 mm

Sub-Category:

Displays

Pixel Count (Vertical):

228 Pixel

Viewing Area Height:

53 mm

Viewing Area Length:

71 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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