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ADM1033ARQZ-RL7

Onsemi

ADM1033ARQZ-RL7 by Onsemi

ADM1033ARQZ-RL7 by Onsemi is an 8-bit temperature sensor with a supply voltage range of 3V to 3.6V and accuracy of ±2 °C. It operates b/w -40°C to 125°C, suitable for various applications requiring precise temperature monitoring in a compact rectangular package with a 2-wire interface for easy integration.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,369 parts In-Stock

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Digiode

USA . 462 parts In-Stock

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Native Components

USA . 209 parts In-Stock

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$8.780

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Northwest PG Solutions

USA . 222 parts In-Stock

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$8.692

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AZTECH Wire

Italy . 323 parts In-Stock

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Problanco Electronics

Mexico . 6,626 parts In-Stock

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SupplyDigital Components

Austria . 2,976 parts In-Stock

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TANS Electronics

Latvia . 2,532 parts In-Stock

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Kulean Microsystems

USA . 1,160 parts In-Stock

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UHIMA Technologies

Türkiye . 939 parts In-Stock

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Corphita

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Corohmni

South Africa . 156 parts In-Stock

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Microchip USA

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Overview

Enhance your temperature sensing capabilities with the ADM1033ARQZ-RL7 by Onsemi. As a leader in temperature sensor technology, Onsemi delivers top-quality products that are reliable and accurate. The ADM1033ARQZ-RL7 is perfect for a wide range of applications, offering precise temperature readings with ease. Its compact size and versatile design make it ideal for various electronic devices. Trust Onsemi to provide you with the best in temperature sensor technology, ensuring optimal performance and peace of mind. Elevate your temperature sensing experience with the ADM1033ARQZ-RL7 today!

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility and compatibility with various power sources.

No. of Bits: 8

8 bits provide a good level of resolution for temperature sensing, allowing for accurate measurements.

Body Width: 3.91 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Multiple types of sensors/transducers offer versatility in usage scenarios.

Body Height: 1.55 mm

Low body height enables easy integration and placement in various devices or systems.

Package Shape or Style: RECTANGULAR

Rectangular shape provides a standardized form factor for easy mounting and installation.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power usage and operation.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in diverse environments and conditions.

Minimum Operating Temperature: -40 °C

Operational at very low temperatures makes it suitable for cold storage or outdoor applications.

Terminal Finish: Tin (Sn)

Tin finish provides good conductivity and solderability for reliable connections.

Maximum Operating Current: 3 mA

Low operating current ensures energy efficiency and minimizes power consumption.

Housing: PLASTIC

Plastic housing offers durability and lightweight construction for ease of handling and installation.

Maximum Accuracy °C: 2

High accuracy of 2 °C ensures precise temperature readings for critical applications.

Body Length/Diameter: 4.9 mm

Small body length/diameter allows for space-efficient design and placement.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection for seamless integration.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices or systems.

Mounting Feature: SURFACE MOUNT

Surface mount capability enables easy and secure attachment to circuit boards or surfaces.

Technical Specifications

Temperature Sensors ADM1033ARQZ-RL7 attributes and parameters. Explore more Temperature Sensors devices from Onsemi

Specs

Maximum Accuracy (Cel):

2

Additional Features:

HYSTERESIS 500MV

Body Width:

3.91 inch

Body Height:

1.55 mm

Body Length/Diameter:

4.9 mm

Housing:

PLASTIC

JESD-609 Code:

e3

Mounting Feature:

No. of Bits:

8

Maximum Operating Current:

3 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Terminal Finish:

Tin (Sn)

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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