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ADM1022ARQZ-R7

Onsemi

ADM1022ARQZ-R7 by Onsemi

ADM1022ARQZ-R7 by Onsemi is a temperature sensor IC with 2.6mA supply current, operating from 0 °C to 85°C. It features logic input and analog output in a 16-SSOP package, suitable for sensor and detector interfaces in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

ADM1022ARQZ-R7 by Onsemi
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,713 parts In-Stock

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5,713

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Digiode

USA . 1,711 parts In-Stock

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1,711

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$18.040

100+ parts

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226

$18.040

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QUARKTWIN TECHNOLOGY LTD

USA . 17,857 parts In-Stock

1+ parts

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17,857

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TANS Electronics

Latvia . 7,486 parts In-Stock

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7,486

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Kulean Microsystems

USA . 6,325 parts In-Stock

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6,325

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SupplyDigital Components

Austria . 5,827 parts In-Stock

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5,827

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Microchip USA

USA . 5,081 parts In-Stock

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5,081

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Problanco Electronics

Mexico . 2,677 parts In-Stock

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2,677

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Northwest PG Solutions

USA . 1,373 parts In-Stock

1+ parts

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$4.789

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1,373

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$4.789

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Corphita

USA . 1,052 parts In-Stock

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1,052

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UHIMA Technologies

Türkiye . 500 parts In-Stock

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500

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Corohmni

South Africa . 475 parts In-Stock

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475

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Native Components

USA . 450 parts In-Stock

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$4.740

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450

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$4.740

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Overview

Discover the innovative ADM1022ARQZ-R7 by Onsemi, a high-quality temperature sensor that offers unparalleled accuracy and reliability. Manufactured by Onsemi, a trusted leader in integrated circuits, this product is perfect for sensor and detector interfaces, providing precise temperature readings with ease. With a low current supply and a wide operating temperature range, this product is ideal for a variety of applications. Trust Onsemi's reputation for excellence and invest in the ADM1022ARQZ-R7 for superior performance and value.

Feature Benefit Bullets

Standard Package: 1,000

Buyer can purchase in bulk quantities, ideal for mass production projects.

Category: Integrated Circuits (ICs)

Provides high level of integration for efficient circuit design.

Type: Temperature Sensor

Ideal for applications requiring precise temperature monitoring.

Operating Temperature: 0 °C ~ 85°C

Suitable for a wide range of temperature monitoring applications.

Mounting Type: Surface Mount

Allows for easy and secure installation on PCBs.

Technical Specifications

Additional Parts ADM1022ARQZ-R7 attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Operating Temperature:

0°C ~ 85°C

Input Type:

Logic

Category:

Integrated Circuits (ICs)
Interface Sensor and Detector Interfaces

Output Type:

Analog

Current - Supply:

2.6 mA

Mounting Type:

Surface Mount

Supplier Device Package:

16-QSOP

Standard Package:

1,000

Type:

Temperature Sensor

Package / Case:

16-SSOP (0.154", 3.90mm Width)

Package:

Tape & Reel (TR)

Base Product Number:

ADM1022

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADM1022ARQZ-R7 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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