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ADM1021ARQZ-REEL

Onsemi

ADM1021ARQZ-REEL by Onsemi

ADM1021ARQZ-REEL by Onsemi is a Temp Monitoring System IC with sensing temperature range of 0 °C to 100°C. It offers ±1°C local and ±5°C remote accuracy, operates on 3V to 5.5V supply voltage, and has SMBus output type. Ideal for thermal management applications in power management systems, it features ADC, Comparator, Multiplexer, and Register Bank topology in a compact 16-SSOP package.

Median Price

$1.125

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,156 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,720 parts In-Stock

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Bristol Electronics

USA . 1,720 parts In-Stock

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$1.125

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$0.990

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$0.990

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Dan-Mar Components

USA . 1,720 parts In-Stock

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Digiode

USA . 595 parts In-Stock

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,088 parts In-Stock

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$2.640

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$2.640

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AZTECH Wire

Italy . 348 parts In-Stock

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$12.480

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Kulean Microsystems

USA . 7,133 parts In-Stock

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SupplyDigital Components

Austria . 6,889 parts In-Stock

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TANS Electronics

Latvia . 6,316 parts In-Stock

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Problanco Electronics

Mexico . 1,409 parts In-Stock

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Vigor

Singapore . 1,080 parts In-Stock

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Corphita

USA . 921 parts In-Stock

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Corohmni

South Africa . 388 parts In-Stock

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UHIMA Technologies

Türkiye . 260 parts In-Stock

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Native Components

USA . 145 parts In-Stock

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$2.328

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Microchip USA

USA . 102 parts In-Stock

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Overview

Enhance your thermal management system with the ADM1021ARQZ-REEL by Onsemi. This integrated circuit offers precise temperature monitoring, both internally and externally, with an impressive accuracy level. With its SMBus output type and alarm feature, this sensor provides a reliable solution for power management applications. Trust in Onsemi's reputation for quality and innovation, and elevate your system's performance with the ADM1021ARQZ-REEL.

Feature Benefit Bullets

Standard Package: 2,500

Large quantity in each package ensures availability for multiple applications without needing to frequently restock.

Category: Integrated Circuits (ICs), Power Management (PMIC)

Designed specifically for power management systems, ensuring efficient monitoring and control of temperature within the system.

Function: Temp Monitoring System (Sensor)

Allows for accurate monitoring of temperature, ensuring optimal performance and preventing damage due to overheating.

Accuracy: ±1 °C Local, ±5°C Remote

High level of accuracy ensures precise temperature measurements both locally and remotely, enhancing the reliability of the system.

Output Alarm: Yes

Ability to set alarm notifications based on temperature thresholds, providing early warning of any potential issues in the system.

Operating Temperature: 0 °C ~ 100°C

Wide operating temperature range allows for versatile use in different environments and conditions.

Mounting Type: Surface Mount

Easy to install and secure onto the system board, saving time and effort during assembly.

Supplier Device Package: 16-QSOP

Standardized package from a reliable supplier ensures compatibility and quality performance.

Technical Specifications

Additional Parts ADM1021ARQZ-REEL attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Operating Temperature:

0°C ~ 100°C

Sensing Temperature:

0°C ~ 100°C, External Sensor

Category:

Integrated Circuits (ICs)
Power Management (PMIC) Thermal Management

Output Type:

SMBus

Topology:

ADC, Comparator, Multiplexer, Register Bank

Mounting Type:

Surface Mount

Supplier Device Package:

16-QSOP

Standard Package:

2,500

Function:

Temp Monitoring System (Sensor)

Accuracy:

±1°C Local, ±5°C Remote

Package / Case:

16-SSOP (0.154", 3.90mm Width)

Sensor Type:

Internal and External

Voltage - Supply:

3V ~ 5.5V

Output Fan:

No

Package:

Tape & Reel (TR)

Output Alarm:

Yes

Base Product Number:

ADM1021

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

ADM1021ARQZ-REEL Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Authentic purchasing experiences

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