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74VHC164N

Onsemi

74VHC164N by Onsemi

SERIAL IN PARALLEL OUT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.281

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,146 parts In-Stock

1+ parts

-

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$0.304

1k+ parts

$0.252

10k+ parts

$0.225

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-

$0.304

$0.252

$0.225

DigiKey

USA . 10,146 parts In-Stock

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-

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$0.260

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$0.260

Verical

USA . 10,146 parts In-Stock

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$0.281

10,146

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$0.281

Distributors (In-Stock)

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Digiode

USA . 2,159 parts In-Stock

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$0.237

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$0.237

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Vyrian

USA . 2,827 parts In-Stock

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$0.249

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DigiKey Marketplace

USA . 10,146 parts In-Stock

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Anansix

USA . 1,372 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,696 parts In-Stock

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$0.224

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1,696

$0.224

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Corohmni

South Africa . 499 parts In-Stock

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$0.249

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499

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QUARKTWIN TECHNOLOGY LTD

USA . 7,909 parts In-Stock

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Kulean Microsystems

USA . 6,689 parts In-Stock

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Kepictronics

USA . 6,319 parts In-Stock

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Metaverse IC Inc.

Canada . 6,319 parts In-Stock

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Microchip USA

USA . 4,582 parts In-Stock

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SupplyDigital Components

Austria . 3,660 parts In-Stock

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Problanco Electronics

Mexico . 3,479 parts In-Stock

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TANS Electronics

Latvia . 2,729 parts In-Stock

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Glotronic Ltd.

UK . 2,300 parts In-Stock

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Supply Digital

USA . 1,654 parts In-Stock

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Native Components

USA . 751 parts In-Stock

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Northwest PG Solutions

USA . 664 parts In-Stock

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UHIMA Technologies

Türkiye . 311 parts In-Stock

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Technical Specifications

Digital Shift Registers 74VHC164N attributes and parameters. Explore more Digital Shift Registers devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

19.18 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

45000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/5.5

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

105 MHz

Trade Compliance

74VHC164N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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