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6N135TVM

Onsemi

6N135TVM by Onsemi

6N135TVM by Onsemi is a SINGLE optocoupler with 0.025A forward current, 5000V isolation voltage, and 1MBps data rate. Ideal for logic IC output applications, it operates b/w 0-70 °C temperature range using through hole mount method.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,675 parts In-Stock

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Digiode

USA . 389 parts In-Stock

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Native Components

USA . 253 parts In-Stock

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$1.130

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Northwest PG Solutions

USA . 549 parts In-Stock

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$1.243

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AZTECH Wire

Italy . 1,036 parts In-Stock

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$12.600

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TANS Electronics

Latvia . 3,627 parts In-Stock

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Problanco Electronics

Mexico . 3,403 parts In-Stock

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Kulean Microsystems

USA . 2,190 parts In-Stock

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SupplyDigital Components

Austria . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 722 parts In-Stock

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Corohmni

South Africa . 201 parts In-Stock

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Corphita

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Overview

Unlock seamless communication and reliable performance with the 6N135TVM by Onsemi. Crafted by a trusted manufacturer, this optocoupler circuit output offers unparalleled quality and efficiency. Ideal for various applications, this single configuration device boasts a maximum isolation voltage of 5000V and a nominal data rate of 1MBps, ensuring safe and speedy data transmission. Say goodbye to connectivity issues and hello to simplified operations with the 6N135TVM - your ultimate solution for seamless communication.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into a variety of circuits without the need for additional components for isolation.

Maximum Forward Current: 0.025 A

Capable of handling high forward currents, ensuring reliable performance under heavy loads.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Specifically designed for logic IC output applications, providing precise and efficient signal transmission.

Minimum Supply Voltage: 4.5 V

Operates effectively with low supply voltages, making it suitable for a wide range of electronic devices.

Maximum Operating Temperature: 70 °C

Withstands high temperatures, allowing for operation in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold temperatures, ensuring reliable performance in diverse settings.

Packing Method: TUBE

Securely packaged in tubes for easy handling and storage, reducing the risk of damage during shipping and handling.

Maximum Isolation Voltage: 5000 V

Provides high isolation voltage, enhancing safety and protection against electrical hazards.

Nominal Data Rate: 1 MBps

Delivers high data transmission rates, ideal for applications requiring fast and efficient communication.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature enables secure and stable placement on circuit boards, ensuring reliable connections.

Maximum On State Current: 0.008 A

Low on-state current ensures energy efficiency and prevents overheating during operation.

Technical Specifications

Optocoupler Circuit Outputs 6N135TVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, TTL AND CMOS COMPATIBLE, UL APPROVED

Configuration:

SINGLE

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Supply Voltage:

4.5 V

Trade Compliance

6N135TVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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