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3EZ16D5RLG

Onsemi

3EZ16D5RLG by Onsemi

3EZ16D5RLG by Onsemi is a Zener diode with a nominal reference voltage of 16V and max power dissipation of 1W. It operates in temperatures ranging from -65 to 200°C, making it suitable for various applications requiring stable voltage regulation. With a max dynamic impedance of 5.5 ohm, this diode is ideal for circuits where precise voltage control is essential.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 9,000 parts In-Stock

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$0.090

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$0.090

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$0.090

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$0.090

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Digiode

USA . 2,099 parts In-Stock

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$0.086

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$0.086

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Chip Stock

USA . 56,000 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 1,000 parts In-Stock

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VNN

France . 50 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,330 parts In-Stock

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$0.053

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Ampacity Inc.

Singapore . 8,555 parts In-Stock

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$0.076

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Corphita

USA . 995 parts In-Stock

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$0.081

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995

$0.081

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Corohmni

South Africa . 353 parts In-Stock

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$0.090

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AZTECH Wire

Italy . 928 parts In-Stock

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$16.640

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QUARKTWIN TECHNOLOGY LTD

USA . 7,291 parts In-Stock

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SupplyDigital Components

Austria . 6,311 parts In-Stock

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Kulean Microsystems

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Continental Prestige Electronics

USA . 4,125 parts In-Stock

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TANS Electronics

Latvia . 3,690 parts In-Stock

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Argo Parts USA

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Problanco Electronics

Mexico . 1,897 parts In-Stock

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UHIMA Technologies

Türkiye . 619 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your electronic projects with the 3EZ16D5RLG Zener Diode by Onsemi. Crafted with precision and quality materials, this single-config diode offers a wide range of applications in voltage regulation and protection circuits. With a nominal reference voltage of 16V and maximum power dissipation of 1W, this Zener diode ensures reliable performance even in extreme temperatures. Trust Onsemi's reputation for excellence and innovation to bring added value and benefits to your projects. Choose the 3EZ16D5RLG for superior quality and efficiency in all your electronic endeavors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent insulation and protection for the diode, ensuring reliability and longevity.

Working Test Current: 47 mA

The high test current allows for efficient and reliable operation of the diode in various applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this diode can withstand rigorous conditions without sacrificing performance.

Nominal Reference Voltage: 16 V

The precise reference voltage of 16 V ensures accurate voltage regulation and stability in the circuit.

Maximum Power Dissipation: 1 W

The high power dissipation capability allows this diode to handle high voltage and current loads without overheating.

Technical Specifications

Zener Diodes 3EZ16D5RLG attributes and parameters. Explore more Zener Diodes devices from Onsemi

Specs

Case Connection:

ISOLATED

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

Maximum Dynamic Impedance:

5.5 ohm

JEDEC-95 Code:

DO-41

JESD-30 Code:

O-PALF-W2

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

LONG FORM

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

1 W

Qualification:

Not Qualified

Nominal Reference Voltage:

16 V

Sub-Category:

Voltage Reference Diodes

Surface Mount:

NO

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Voltage Tolerance:

5 %

Working Test Current:

47 mA

Trade Compliance

3EZ16D5RLG Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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