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UJA1076ATW/3V3/1J

NXP Semiconductors

UJA1076ATW/3V3/1J by NXP Semiconductors

MICROCONTROLLER; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,687 parts In-Stock

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2,687

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Anansix

USA . 2,071 parts In-Stock

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2,071

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Digiode

USA . 982 parts In-Stock

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982

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,466 parts In-Stock

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$13.000

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$13.000

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Microchip USA

USA . 4,471 parts In-Stock

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$15.246

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AZTECH Wire

Italy . 1,095 parts In-Stock

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$20.850

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$20.850

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Component Stockers USA

USA . 1,361 parts In-Stock

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$40.730

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1,361

$40.730

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QUARKTWIN TECHNOLOGY LTD

USA . 4,394 parts In-Stock

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4,394

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UNI Independent Distributors

Spain . 1,579 parts In-Stock

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Corphita

USA . 258 parts In-Stock

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258

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Technical Specifications

Microcontrollers UJA1076ATW/3V3/1J attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

UJA1076ATW/3V3/1J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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