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UDA1361TS/N1,118

NXP Semiconductors

UDA1361TS/N1,118 by NXP Semiconductors

NXP Semiconductors UDA1361TS/N1,118 is a 24-bit ADC with 2 analog in channels. It operates at industrial temperatures (-40 to 85°C) and has a max analog input voltage of 3.6V. Ideal for applications requiring high-resolution audio conversion like professional audio equipment.

Median Price

$0.862

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 800 parts In-Stock

1+ parts

$0.862

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800

$0.862

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Vyrian

USA . 3,044 parts In-Stock

1+ parts

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3,044

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Anansix

USA . 2,608 parts In-Stock

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2,608

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Digiode

USA . 2,416 parts In-Stock

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2,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

$0.811

10k+ parts

-

500

$0.845

-

$0.811

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Argo Parts USA

USA . 1,466 parts In-Stock

1+ parts

$0.862

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1,466

$0.862

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Continental Prestige Electronics

USA . 1,071 parts In-Stock

1+ parts

$0.862

100+ parts

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$0.845

1,071

$0.862

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-

$0.845

Corohmni

South Africa . 152 parts In-Stock

1+ parts

$7.825

100+ parts

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152

$7.825

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Semicontronic

India . 1,395 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

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1,395

$10.000

$9.750

$9.700

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Ampacity Inc.

Singapore . 506 parts In-Stock

1+ parts

$10.000

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506

$10.000

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AZTECH Wire

Italy . 345 parts In-Stock

1+ parts

$15.146

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345

$15.146

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Aztec Data Supply Inc.

USA . 3,764 parts In-Stock

1+ parts

$15.480

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3,764

$15.480

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One Stop Electronics

USA . 830 parts In-Stock

1+ parts

$29.000

100+ parts

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830

$29.000

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UNI Independent Distributors

Spain . 8,338 parts In-Stock

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8,338

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QUARKTWIN TECHNOLOGY LTD

USA . 6,895 parts In-Stock

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6,895

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Corphita

USA . 4,152 parts In-Stock

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4,152

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Microchip USA

USA . 3,950 parts In-Stock

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100+ parts

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3,950

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Overview

Elevate your audio experience with the UDA1361TS/N1,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Analog-to-Digital Converters that are designed to enhance performance and precision. Ideal for a wide range of applications, this product offers customers unparalleled value with its advanced features and reliable functionality. Upgrade your projects with the UDA1361TS/N1,118 and unlock endless possibilities in sound technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This package material provides good protection for the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the device.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on PCBs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style helps in heat dissipation and allows for compact design in tight spaces.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring optimal performance.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and stability.

Maximum Seated Height: 0.8 mm

Low maximum seated height helps in slim and compact device design.

Width: 3 mm

Narrow width allows for space-saving on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type offers efficient and reliable power supply support for various applications.

Maximum Time At Peak Reflow Temperature: 30s

Allows for quick and effective soldering during assembly.

Peak Reflow Temperature: 260°C

High peak reflow temperature ensures proper soldering and reliability in harsh conditions.

Length: 4 mm

Compact length contributes to overall miniaturization of the device.

Nominal Threshold Voltage: +4.2V

Well-defined nominal threshold voltage for precise power management.

Maximum Supply Current (Isup): 0.002 mA

Low supply current helps in energy efficiency and prolonging the device's battery life.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for use.

Terminal Pitch: 0.65 mm

Close terminal pitch enables high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 25 V

With a high maximum supply voltage, this IC can handle a wide range of power input without compromising performance.

Technical Specifications

Analog-to-Digital Converters UDA1361TS/N1,118 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

24

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Sample Rate:

96 kHz

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

3.6 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.205 in (5.2 mm)

Maximum Seated Height:

0.059 in (1.5 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

UDA1361TS/N1,118 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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