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UCB1400BE

NXP Semiconductors

UCB1400BE by NXP Semiconductors

UCB1400BE by NXP Semiconductors is a 48-terminal consumer IC with power supply of 3.3V, operating temperature range from -40 to 85°C. It features a flatpack package style suitable for industrial applications requiring low profile and fine pitch components.

Median Price

$6.122

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Tomark Electronics Ltd

UK . 110 parts In-Stock

1+ parts

$4.720

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110

$4.720

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Bristol Electronics

USA . 53 parts In-Stock

1+ parts

$7.524

100+ parts

$3.536

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53

$7.524

$3.536

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Digiode

USA . 3,308 parts In-Stock

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3,308

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Anansix

USA . 1,113 parts In-Stock

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1,113

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Chip Stock

USA . 896 parts In-Stock

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896

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Vyrian

USA . 825 parts In-Stock

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825

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Nova Conductors

Japan . 100 parts In-Stock

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100

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J2 Sourcing AB

Sweden . 94 parts In-Stock

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94

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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ComSIT USA

USA . 19 parts In-Stock

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Goldney Electronics S.L.

Spain . 5 parts In-Stock

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5

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LWI Electronics Inc

India . 2 parts In-Stock

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2

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 825 parts In-Stock

1+ parts

$10.516

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825

$10.516

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One Stop Electronics

USA . 213 parts In-Stock

1+ parts

$15.800

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213

$15.800

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Ampacity Inc.

Singapore . 950 parts In-Stock

1+ parts

$21.800

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950

$21.800

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Lixinc

USA . 18,796 parts In-Stock

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Perfect Parts

USA . 12,320 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 3,500 parts In-Stock

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3,500

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Corphita

USA . 2,598 parts In-Stock

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2,598

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UNI Independent Distributors

Spain . 2,489 parts In-Stock

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2,489

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Assy Fe

Spain . 2,000 parts In-Stock

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2,000

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,196 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Discover the cutting-edge UCB1400BE from NXP Semiconductors, a leading manufacturer known for top-quality semiconductor solutions. This versatile Consumer IC offers a wide range of applications in various devices, promising reliable performance and efficiency. With a focus on innovation and customer satisfaction, NXP Semiconductors delivers unparalleled value with the UCB1400BE, providing users with the benefits of advanced technology and seamless integration. Upgrade your products with this high-performance IC and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for consumer applications.

Surface Mount: YES

This surface mount feature allows for easy installation and space-saving on PCBs, making this product convenient for manufacturing processes.

Package Shape: SQUARE

The square package shape ensures efficient use of space on the PCB, making this product ideal for compact designs.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, this product is specifically designed to meet the demands of consumer electronics applications, ensuring reliability and performance.

Power Supplies (V): 3.3

With a power supply of 3.3V, this product is suitable for low-power consumption applications, saving energy and optimizing efficiency.

No. of Terminals: 48

The high number of terminals on this IC allows for more connectivity options, making it versatile and adaptable for various circuit designs.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style of this IC makes it suitable for densely populated PCB layouts, offering versatility and flexibility in design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high-temperature environments, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C enables this IC to function in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN

The use of tin terminal finish on this product provides corrosion resistance and excellent solderability, ensuring long-term reliability in various operating environments.

Technical Specifications

Other Function Consumer ICs UCB1400BE attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

UCB1400BE General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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