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UCB1400BE,151

NXP Semiconductors

UCB1400BE,151 by NXP Semiconductors

NXP Semiconductors UCB1400BE,151 is a 48-terminal consumer IC with a temperature range of -40 to 85°C. It features a low profile flatpack package style and operates at supply voltages b/w 3-3.6V. Ideal for industrial applications requiring compact design and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,115 parts In-Stock

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Digiode

USA . 3,303 parts In-Stock

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3,303

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Anansix

USA . 474 parts In-Stock

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474

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Nova Conductors

Japan . 83 parts In-Stock

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83

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J2 Sourcing AB

Sweden . 25 parts In-Stock

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25

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Distributors (Availability)

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Ampacity Inc.

Singapore . 209 parts In-Stock

1+ parts

$4.800

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209

$4.800

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AZTECH Wire

Italy . 690 parts In-Stock

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$15.856

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690

$15.856

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One Stop Electronics

USA . 1,286 parts In-Stock

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$17.800

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$17.800

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Microchip USA

USA . 995 parts In-Stock

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$28.034

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995

$28.034

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UNI Independent Distributors

Spain . 5,944 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Corphita

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Overview

Discover the innovative UCB1400BE,151 by NXP Semiconductors, a cutting-edge consumer IC that promises top-notch performance and reliability. With a sleek square package design and industrial-grade temperature grade, this IC is ideal for a wide range of applications. From home electronics to automotive systems, the UCB1400BE,151 delivers unmatched quality and efficiency. Trust NXP Semiconductors to provide you with the best technology on the market, ensuring seamless integration and optimal functionality for all your projects. Elevate your designs with the UCB1400BE,151 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

The surface mount capability of this product allows for easier and more efficient assembly onto PCBs.

Package Shape: SQUARE

The square package shape is space-saving and allows for efficient PCB layout design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this product suitable for a variety of applications and environments.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Other Function Consumer ICs UCB1400BE,151 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3/e4

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN/SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

UCB1400BE,151 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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