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UBA2080T/1,518

NXP Semiconductors

UBA2080T/1,518 by NXP Semiconductors

UBA2080T/1,518 by NXP Semiconductors is a robust MOSFET gate driver designed for automotive applications. It operates within a voltage range of 12.8 V and withstands temperatures from -40 °C to 150 °C. This compact, surface-mount device features an 8-terminal gull-wing design for efficient integration.

Median Price

$0.808

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.793

1k+ parts

$0.658

10k+ parts

$0.587

2,500

-

$0.793

$0.658

$0.587

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.822

10k+ parts

$0.733

2,500

-

-

$0.822

$0.733

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,139 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

-

10k+ parts

-

4,139

$0.618

-

-

-

Vyrian

USA . 3,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,243

-

-

-

-

DigiKey Marketplace

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.680

1k+ parts

-

10k+ parts

-

2,500

-

$0.680

-

-

Anansix

USA . 1,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,032 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

-

10k+ parts

-

1,032

$0.585

-

-

-

AZTECH Wire

Italy . 491 parts In-Stock

1+ parts

$9.590

100+ parts

-

1k+ parts

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10k+ parts

-

491

$9.590

-

-

-

Microchip USA

USA . 9,631 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,631

-

-

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UNI Independent Distributors

Spain . 5,505 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,505

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-

Overview

Unlock the potential of your designs with the UBA2080T/1,518 from NXP Semiconductors, a leader in innovative technology. This robust MOSFET Gate Driver excels in performance and reliability, ensuring optimal functionality in demanding automotive applications. With excellent thermal management and a compact design, it offers unmatched efficiency and durability, empowering you to create cutting-edge solutions with confidence. Elevate your projects with NXP’s trusted quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects the internal components from environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology enables efficient use of board space and contributes to lower production costs, which is essential for compact designs.

Package Shape: RECTANGULAR

A rectangular package shape is beneficial for standardized assembly processes and helps in optimized layout on the PCB.

Power Supplies (V): 12.8

Operating at a nominal supply voltage of 12.8V makes it ideal for automotive and industrial applications where standard voltage levels are prevalent.

No. of Terminals: 8

With 8 terminals, this device offers sufficient connectivity options for robust electrical performance while maintaining simplicity in design.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates high-density board layouts, suitable for modern electronic devices that demand compact form factors.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability in high-temperature environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver can function in extreme cold conditions, ensuring reliable performance across diverse climates.

Terminal Position: DUAL

The dual terminal position enhances signal integrity and aids in heat dispersion, which is critical for high-power applications.

Temperature Grade: AUTOMOTIVE

Designed with an automotive temperature grade, this product meets the rigorous standards required for vehicle applications, ensuring durability and reliability.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and enhances mechanical stability during operation, making it user-friendly for assembly.

Nominal Supply Voltage: 12.8 V

Aligning with standard automotive supply voltages, this feature ensures compatibility with a wide range of vehicle systems for seamless integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is ideal for high-density layouts which saves space while ensuring reliable connections in compact PCB designs.

Technical Specifications

MOSFET Gate Drivers UBA2080T/1,518 attributes and parameters. Explore more MOSFET Gate Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12.8

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Nominal Supply Voltage:

12.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UBA2080T/1,518 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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