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TLVH431DQDBZR,215

NXP Semiconductors

TLVH431DQDBZR,215 by NXP Semiconductors

TLVH431DQDBZR,215 from NXP Semiconductors is a versatile voltage reference with a 1.24V min and 18V max output. It features a compact 3-terminal surface mount design and supports up to 80mA output current. Ideal for precision applications in electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,958 parts In-Stock

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4,958

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Vyrian

USA . 2,654 parts In-Stock

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2,654

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Anansix

USA . 225 parts In-Stock

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225

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One Stop Electronics

USA . 379 parts In-Stock

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$1.500

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379

$1.500

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Microchip USA

USA . 477 parts In-Stock

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$2.419

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477

$2.419

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Advanced Electronics

New Zealand . 87 parts In-Stock

1+ parts

$4.672

100+ parts

$4.252

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$3.831

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87

$4.672

$4.252

$3.831

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AZTECH Wire

Italy . 412 parts In-Stock

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$14.250

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412

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QUARKTWIN TECHNOLOGY LTD

USA . 22,933 parts In-Stock

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22,933

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 4,516 parts In-Stock

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UNI Independent Distributors

Spain . 1,173 parts In-Stock

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Overview

Elevate your designs with the TLVH431DQDBZR,215 from NXP Semiconductors—where superior quality meets unmatched reliability. This versatile voltage reference is ideal for a range of applications, ensuring precision and stability in your circuits. With NXP’s commitment to innovation, you gain access to robust performance and excellent thermal characteristics, empowering your projects while maximizing efficiency and minimizing downtime. Transform your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making this voltage reference suitable for a variety of applications.

Surface Mount: YES

Being surface mount allows for compact designs and efficient use of PCB space, making it ideal for modern electronic devices.

No. of Terminals: 3

Having three terminals facilitates easier integration and enhances the versatility of connections in circuit design.

Minimum Output Voltage: 1.24 V

A minimum output voltage of 1.24 V makes it suitable for low-voltage applications, ensuring compatibility with a wide range of devices.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and reliable electrical connections, contributing to overall product performance.

Maximum Output Voltage: 18 V

With a maximum output voltage of 18 V, this voltage reference can cater to high voltage applications, providing flexibility in usage.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures compatibility with various soldering processes, enhancing manufacturing reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C demonstrates the component's ability to withstand high-temperature soldering processes, ensuring durability.

Maximum Output Current: 0.08 A

The output current capability of 0.08 A provides sufficient drive for connected circuits, enabling the usage in a range of applications.

Technology: BIPOLAR

The bipolar technology offers excellent performance stability and precision, making this voltage reference a reliable choice for critical applications.

Technical Specifications

Voltage References TLVH431DQDBZR,215 attributes and parameters. Explore more Voltage References devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

3

Maximum Output Current:

.08 A

Maximum Output Voltage:

18 V

Minimum Output Voltage:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TO-236

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TLVH431DQDBZR,215 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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