Loading...

TL431BSDT,215

NXP Semiconductors

TL431BSDT,215 by NXP Semiconductors

TL431BSDT,215 from NXP Semiconductors is a 3-terminal adjustable voltage reference with a nominal output of 2.495 V and operates b/w -40 °C to 125 °C. It features a compact SO-TH package, ideal for automotive applications. With a max supply voltage of 36 V, it ensures reliable performance in various circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

-

-

-

-

Vyrian

USA . 2,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,675

-

-

-

-

Anansix

USA . 1,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,076

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 627 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$4.500

-

-

-

One Stop Electronics

USA . 645 parts In-Stock

1+ parts

$5.500

100+ parts

-

1k+ parts

-

10k+ parts

-

645

$5.500

-

-

-

AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$19.130

100+ parts

-

1k+ parts

-

10k+ parts

-

282

$19.130

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,386

-

-

-

-

UNI Independent Distributors

Spain . 6,571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,571

-

-

-

-

Metaverse IC Inc.

Canada . 5,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,480

-

-

-

-

Corphita

USA . 4,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,518

-

-

-

-

Microchip USA

USA . 3,137 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,137

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,950

-

-

-

-

Overview

Elevate your designs with the TL431BSDT,215 from NXP Semiconductors—a pinnacle of reliability in voltage references. With its compact, thin profile and exceptional thermal performance, this three-terminal device is perfect for automotive applications and more. Enjoy adjustable output options that empower versatility while benefiting from NXP's industry-leading quality. Choose TL431BSDT for precision, efficiency, and peace of mind in every project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robustness and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

Trim or Adjustable Output Voltage: YES

The adjustable output feature provides flexibility for customized applications, making it versatile for different circuit requirements.

Package Shape: RECTANGULAR

The rectangular shape is ideal for standardized PCB layouts, promoting easier integration in designs.

Number of Terminals: 3

Three terminals enhance connectivity options, allowing for easier integration into existing circuitry.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This design enables a low-profile footprint, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this component is suitable for automotive and harsh environments.

Minimum Output Voltage: 2.483 V

The ability to achieve low output voltages caters to a wide range of electronic applications.

Minimum Operating Temperature: -40 °C

This wide operating temperature range ensures reliability in extreme conditions, suitable for automotive use.

Terminal Finish: TIN

Tin finishes provide excellent solderability, ensuring good connections during assembly.

Maximum Output Voltage: 2.507 V

Providing a narrow output voltage range is ideal for precision applications requiring tight voltage tolerances.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout designs and easy routing.

Maximum Seated Height: 1.1 mm

Low seated height allows for integration into compact designs without sacrificing performance.

Width: 1.3 mm

Narrow width contributes to the product's suitability for space-constrained applications.

Other IC Type: THREE TERMINAL VOLTAGE REFERENCE

This configuration is widely used, ensuring compatibility with various designs and applications.

Minimum Supply Voltage (Vsup): 2.483 V

The low minimum supply voltage requirement makes it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 30 s

Allows for efficient soldering processes, minimizing the risk of thermal damage to the component.

Peak Reflow Temperature: 260 °C

High peak reflow temperature compatibility ensures resistance to soldering stress in assembly processes.

Length: 2.9 mm

Compact length facilitates integration into tight spaces, ideal for miniaturized electronic designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade certification ensures reliability and durability in demanding automotive applications.

Maximum Output Current: 0.1 A

Supports reasonable output current levels, making it suitable for various consumer and industrial circuits.

Technology: BIPOLAR

Bipolar technology offers good performance characteristics and linearity for high-precision applications.

Terminal Form: GULL WING

Gull wing terminals enhance mechanical stability and ease of soldering.

Terminal Pitch: 0.95 mm

Standard terminal pitch allows for compatibility with various PCB design practices.

Maximum Supply Voltage (Vsup): 36 V

High maximum supply voltage compatibility allows use in high-voltage applications.

Nominal Output Voltage: 2.495 V

Nominal output voltage is well-suited for precision applications requiring stability.

Technical Specifications

Voltage References TL431BSDT,215 attributes and parameters. Explore more Voltage References devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

2.507 V

Minimum Output Voltage:

2.483 V

Nominal Output Voltage:

2.495 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.483 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

TL431BSDT,215 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20