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TJA1043T/1U

NXP Semiconductors

TJA1043T/1U by NXP Semiconductors

NXP Semiconductors' TJA1043T/1U is a small outline interface circuit with 14 terminals, suitable for telecom applications. It operates at a nominal voltage of 5V and can withstand peak reflow temperatures up to 260°C. The package body material is plastic/epoxy, making it ideal for surface mount installations in automotive environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 5,716 parts In-Stock

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Digiode

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Anansix

USA . 2,012 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Microchip USA

USA . 325 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 488 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 991 parts In-Stock

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$755.630

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

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UNI Independent Distributors

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Argo Parts USA

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Vigor

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Continental Prestige Electronics

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Corphita

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Aranea Global

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Overview

Unlock seamless connectivity and robust reliability with the TJA1043T/1U from NXP Semiconductors. Designed for high-performance network interfaces, this innovative product boasts top-tier quality and AEC-Q100 screening level to ensure superior functionality in various applications. With its compact design and dual terminal position, this interface circuit offers unmatched convenience and flexibility. Experience the value of effortless integration and enhanced performance with the TJA1043T/1U - your go-to solution for reliable networking solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

With AEC-Q100 screening level, this product is designed to meet automotive industry standards for reliability and quality, making it a reliable choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design that saves space on the PCB, making it suitable for applications with limited board space.

No. of Terminals: 14

With 14 terminals, this product offers enough connectivity options for various input/output configurations, enhancing its versatility in different networking setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact form factor, making it suitable for devices where space is a constraint.

Terminal Position: DUAL

The dual terminal position allows for a secure connection on the circuit board, reducing the risk of connection issues and ensuring reliable performance.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75 mm enables a slim profile design, ideal for applications where space constraints are critical.

Width: 3.9 mm

The 3.9 mm width of this product offers a compact footprint, allowing for efficient use of space on the PCB.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable performance during assembly.

Length: 8.65 mm

The 8.65 mm length provides a balanced size that fits well in various electronic devices without compromising on functionality.

Terminal Form: GULL WING

The gull wing terminal form offers easy soldering and secure connection, making it a preferred choice for high-reliability applications.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this product facilitates seamless communication between different network devices, enhancing overall system compatibility and performance.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to integrate into existing setups.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables precise and secure connections on the PCB, ensuring reliable performance in demanding networking applications.

Technical Specifications

Network Interfaces TJA1043T/1U attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1043T/1U Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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