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TJA1041AT/VM,512

NXP Semiconductors

TJA1041AT/VM,512 by NXP Semiconductors

TJA1041AT/VM,512 by NXP Semiconductors is a CAN transceiver designed for automotive applications. It operates at 5V with a data rate of 1 Mbps and features a compact 14-terminal surface mount package. AEC-Q100 screening ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,990 parts In-Stock

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2,990

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Vyrian

USA . 2,569 parts In-Stock

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2,569

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Anansix

USA . 2,345 parts In-Stock

1+ parts

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2,345

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J2 Sourcing AB

Sweden . 39 parts In-Stock

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39

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North Shore Components

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 207 parts In-Stock

1+ parts

$1.621

100+ parts

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207

$1.621

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AZTECH Wire

Italy . 810 parts In-Stock

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$13.110

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810

$13.110

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One Stop Electronics

USA . 956 parts In-Stock

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$482.000

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956

$482.000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,651 parts In-Stock

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20,651

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Corphita

USA . 1,001 parts In-Stock

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1,001

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UNI Independent Distributors

Spain . 842 parts In-Stock

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842

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Overview

Elevate your connectivity with the TJA1041AT/VM,512 from NXP Semiconductors, a leader in innovative technology. This CAN transceiver delivers robust performance for automotive and industrial applications, ensuring reliable data transmission where it matters most. With AEC-Q100 certification, experience unmatched quality and durability. Simplify your designs while enjoying superior power efficiency and compact packaging—perfect for modern network interfaces that demand excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a durable and lightweight package, making it suitable for various electronic applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact PCB designs, saving space and improving assembly efficiency.

Screening Level: AEC-Q100

Compliance with AEC-Q100 indicates high reliability and robustness, making it ideal for automotive and critical applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, facilitating better design aesthetics and performance.

Power Supplies (V): 5

Operating at 5V makes it compatible with a wide range of standard electronic systems, simplifying integration into existing designs.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options, accommodating various configurations and enhancing versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers a compact footprint, allowing for high-density mounting in space-constrained applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and provides a good level of corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB design, providing options for layout configurations.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm contributes to a slim profile, making it suitable for low-profile or portable applications.

Width: 3.9 mm

A narrow width facilitates placement in densely populated boards, optimizing the use of available space.

Length: 8.65 mm

The compact length allows for smaller designs, making it a good choice for applications requiring slim form factors.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, ideal for energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form supports efficient soldering processes and enhances mechanical stability on the PCB.

Maximum Supply Current: 0.08 mA

A very low maximum supply current increases the overall energy efficiency of the product, making it suitable for battery-operated devices.

Telecom IC Type: CAN TRANSCEIVER

Designed as a CAN transceiver, it is tailored for robust communication in automotive and industrial networks.

Nominal Supply Voltage: 5 V

The nominal supply voltage aligns with common electronic devices, ensuring compatibility across a broad range of applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of soldering, enabling tighter layouts.

Data Rate: 1 Mbps

With a data rate of 1 Mbps, this product supports efficient data transmission for a variety of network communication protocols.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable handling precautions are required, making it suitable for standard assembly processes.

Technical Specifications

Network Interfaces TJA1041AT/VM,512 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TJA1041AT/VM,512 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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