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TEA1938T/1J

NXP Semiconductors

TEA1938T/1J by NXP Semiconductors

SWITCHING CONTROLLER; No. of Terminals: 10; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Operating Temperature: 125 Cel;

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,624 parts In-Stock

1+ parts

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7,624

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Anansix

USA . 1,281 parts In-Stock

1+ parts

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1,281

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Digiode

USA . 758 parts In-Stock

1+ parts

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758

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 184 parts In-Stock

1+ parts

$0.777

100+ parts

-

1k+ parts

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184

$0.777

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One Stop Electronics

USA . 667 parts In-Stock

1+ parts

$5.500

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667

$5.500

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AZTECH Wire

Italy . 155 parts In-Stock

1+ parts

$13.810

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155

$13.810

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Component Stockers USA

USA . 695 parts In-Stock

1+ parts

$99.990

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695

$99.990

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Corphita

USA . 4,482 parts In-Stock

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4,482

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UNI Independent Distributors

Spain . 4,053 parts In-Stock

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4,053

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Technical Specifications

Switching Regulators & Controllers TEA1938T/1J attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

RESONANT CONTROL

Nominal Input Voltage:

20 V

JESD-30 Code:

R-PDSO-G10

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Voltage:

20 V

Minimum Output Voltage:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP10,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Maximum Switching Frequency:

136 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TEA1938T/1J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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