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TEA1752T/1791/DB/9

NXP Semiconductors

TEA1752T/1791/DB/9 by NXP Semiconductors

TEA1752T/1791/DB/9 by NXP Semiconductors is a compact switching regulator with a max switching frequency of 150 kHz. It features a dual terminal position and current-mode control for efficient power management. Ideal for space-constrained applications, it comes in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,303 parts In-Stock

1+ parts

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7,303

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Digiode

USA . 3,786 parts In-Stock

1+ parts

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1k+ parts

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3,786

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Anansix

USA . 1,633 parts In-Stock

1+ parts

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1,633

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,220 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

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10k+ parts

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1,220

$1.500

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AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$15.790

100+ parts

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852

$15.790

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Component Stockers USA

USA . 11 parts In-Stock

1+ parts

$6,139.690

100+ parts

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11

$6,139.690

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UNI Independent Distributors

Spain . 7,319 parts In-Stock

1+ parts

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7,319

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Corphita

USA . 3,688 parts In-Stock

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3,688

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Overview

Elevate your power management solutions with the TEA1752T/1791/DB/9 from NXP Semiconductors. Renowned for quality and reliability, NXP delivers this versatile switching regulator designed to enhance efficiency in various applications, from consumer electronics to industrial systems. Enjoy streamlined integration, increased performance, and energy savings that translate into real-world benefits—making it the ideal choice for forward-thinking engineers seeking excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensures reliability and longevity, making it suitable for various applications.

Surface Mount: YES

Facilitates automatic assembly and saves board space, enhancing manufacturing efficiency.

Package Shape: RECTANGULAR

Optimizes layout for circuit board design, allowing for efficient use of space and easier thermal management.

No. of Terminals: 16

Provides ample connection points for various functions, enabling versatile configurations and designs.

Package Style (Meter): SMALL OUTLINE

Compact size is ideal for low-profile applications, fitting into tight spaces without compromising performance.

Control Mode: CURRENT-MODE

Allows for improved transient response and better regulation, enhancing overall system stability.

Terminal Position: DUAL

Facilitates easier connections and better layout options in circuit designs, enhancing the assembly process.

Maximum Switching Frequency: 150 kHz

Higher switching frequencies lead to smaller external components, reducing overall circuit size and weight.

Terminal Form: GULL WING

Design ensures reliable solder connections and optimizes surface mount assembly processes.

Terminal Pitch: 1.27 mm

Standard pitch allows compatibility with various PCB designs and enables easier routing of electrical connections.

Technical Specifications

Switching Regulators & Controllers TEA1752T/1791/DB/9 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

150 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1752T/1791/DB/9 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

9023.00.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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