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TEA1751T/1791/DB/9

NXP Semiconductors

TEA1751T/1791/DB/9 by NXP Semiconductors

TEA1751T/1791/DB/9 by NXP Semiconductors is a compact switching regulator designed for efficient power management. It features a max switching frequency of 150 kHz, 16 terminals in a small outline package, and operates in current-mode control. Ideal for applications requiring reliable voltage regulation in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,482 parts In-Stock

1+ parts

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4,482

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Vyrian

USA . 2,196 parts In-Stock

1+ parts

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2,196

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Anansix

USA . 2,038 parts In-Stock

1+ parts

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2,038

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 448 parts In-Stock

1+ parts

$2.500

100+ parts

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448

$2.500

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AZTECH Wire

Italy . 727 parts In-Stock

1+ parts

$21.340

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727

$21.340

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Corphita

USA . 3,275 parts In-Stock

1+ parts

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3,275

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UNI Independent Distributors

Spain . 2,601 parts In-Stock

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2,601

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Overview

Elevate your designs with the TEA1751T/1791/DB/9 from NXP Semiconductors—a leader in innovative technology solutions. This high-performance switching regulator optimizes efficiency, ensuring reliable power management for a variety of applications. Its compact design and dual terminal positioning make it perfect for space-constrained projects. Trust the quality of NXP to drive performance, reduce costs, and enhance your product's longevity. Experience unmatched reliability and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material enhances the overall robustness of the product, making it ideal for various applications.

Surface Mount: YES

The surface mount design allows for a smaller footprint and easier integration into compact circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout and assembly processes in circuit design.

No. of Terminals: 16

With 16 terminals, this product ensures versatile connectivity options, enabling complex circuitry arrangements.

Package Style (Meter): SMALL OUTLINE

The small outline style is beneficial for minimizing space usage while maintaining high performance in electronic devices.

Control Mode: CURRENT-MODE

The current-mode control provides excellent response to load variations, enhancing the stability and efficiency of the regulator.

Terminal Position: DUAL

Dual terminal positioning supports effective heat dissipation and can simplify PCB layout by allowing for flexible routing.

Maximum Switching Frequency: 150 kHz

A maximum switching frequency of 150 kHz allows for efficient power conversion while reducing energy losses and heat generation.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and allow for easy inspection post-assembly, providing confidence in electrical connections.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch permits higher density in component placement, making it suitable for modern compact electronic designs.

Technical Specifications

Switching Regulators & Controllers TEA1751T/1791/DB/9 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

150 kHz

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TEA1751T/1791/DB/9 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

9023.00.00.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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