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TEA1733CP/N1,112

NXP Semiconductors

TEA1733CP/N1,112 by NXP Semiconductors

TEA1733CP/N1,112 by NXP Semiconductors is a current-mode switching regulator in an 8-terminal rectangular package. It features a max switching frequency of 71 kHz and a 2.54 mm terminal pitch. Ideal for power supply applications, it ensures efficient voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,591 parts In-Stock

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Digiode

USA . 4,938 parts In-Stock

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4,938

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Anansix

USA . 2,326 parts In-Stock

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One Stop Electronics

USA . 1,418 parts In-Stock

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$6.500

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1,418

$6.500

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AZTECH Wire

Italy . 851 parts In-Stock

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$19.480

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851

$19.480

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$22.055

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$20.070

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$18.085

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5,000

$22.055

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$18.085

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Microchip USA

USA . 195 parts In-Stock

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$23.249

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195

$23.249

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Component Stockers USA

USA . 618 parts In-Stock

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$99.990

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618

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UNI Independent Distributors

Spain . 7,274 parts In-Stock

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Corphita

USA . 101 parts In-Stock

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Overview

Unlock the potential of your designs with the TEA1733CP/N1,112 from NXP Semiconductors. Renowned for quality and innovation, NXP delivers a robust switching regulator that enhances efficiency and reliability in various applications, from power supplies to LED drivers. With its user-friendly design and superior performance, this regulator not only simplifies your projects but also maximizes energy savings, empowering you to create cutting-edge solutions with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the product reliable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on circuit boards, making design integration straightforward and compact.

No. of Terminals: 8

With eight terminals, this switching regulator provides multiple connection options, allowing for versatile configurations in different circuit designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process in automated systems and enhances the overall system efficiency.

Control Mode: CURRENT-MODE

The current-mode control provides excellent transient response and system stability, which results in improved performance for various load conditions.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in layout and design, facilitating easier routing of connections in complex circuit environments.

Maximum Switching Frequency: 71 kHz

A maximum switching frequency of 71 kHz allows for fine control of power conversion, contributing to high efficiency and reduced electrical noise.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support, ensuring reliable connections that can handle substantial physical stress during use.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm ensures compatibility with common PCB designs and components, making it easy to integrate into existing systems.

Technical Specifications

Switching Regulators & Controllers TEA1733CP/N1,112 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Maximum Switching Frequency:

71 kHz

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TEA1733CP/N1,112 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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