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TEA1733BT/N2,118

NXP Semiconductors

TEA1733BT/N2,118 by NXP Semiconductors

TEA1733BT/N2,118 by NXP Semiconductors is a compact switching controller designed for efficient power management. It operates with a nominal input voltage of 20V, supports a max switching frequency of 133kHz, and features current-mode control. Ideal for applications requiring reliable voltage regulation in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,362 parts In-Stock

1+ parts

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7,362

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Digiode

USA . 3,473 parts In-Stock

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3,473

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Anansix

USA . 2,134 parts In-Stock

1+ parts

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2,134

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 314 parts In-Stock

1+ parts

$0.465

100+ parts

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314

$0.465

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One Stop Electronics

USA . 645 parts In-Stock

1+ parts

$6.500

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645

$6.500

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AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$21.890

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526

$21.890

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QUARKTWIN TECHNOLOGY LTD

USA . 26,144 parts In-Stock

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26,144

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UNI Independent Distributors

Spain . 1,612 parts In-Stock

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1,612

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Perfect Parts

USA . 1,397 parts In-Stock

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1,397

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Corphita

USA . 960 parts In-Stock

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960

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Overview

Unlock the power of efficiency with the TEA1733BT/N2,118 from NXP Semiconductors—your go-to solution for reliable switching regulation. Engineered with precision, this compact controller excels in delivering outstanding performance across various applications, from power supplies to consumer electronics. Rely on NXP's legacy of innovation and quality to enhance your designs, ensuring optimal energy management and seamless integration, all while maximizing value and reducing costs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures a robust design, making the product resistant to environmental stresses.

Surface Mount: YES

Surface mount configuration allows for compact design and easier integration into modern PCB architectures.

Package Shape: RECTANGULAR

Rectangular shape optimizes the space utilization on the PCB, facilitating efficient layout and design.

No. of Terminals: 8

Eight terminals provide versatile connectivity options, accommodating various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for applications with size constraints, enhancing design flexibility.

Control Mode: CURRENT-MODE

Current-mode control provides improved stability and dynamic response, making the regulator effective under varying load conditions.

Terminal Finish: MATTE TIN

Matte tin finish promotes better solderability and reduces the risk of oxidation, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning supports efficient PCB routing and enhances the mechanical strength of connections.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a flatter profile, which is beneficial for compact device designs.

Width: 3.9 mm

Narrow width is advantageous for high-density applications, allowing for placement in smaller spaces.

Other IC type: SWITCHING CONTROLLER

Being a switching controller, it allows for efficient energy conversion, reducing overall power losses.

Nominal Input Voltage: 20 V

A nominal input voltage of 20V ensures compatibility with a wide range of power sources, making it versatile.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance means the IC can withstand the soldering process without damage.

Length: 4.9 mm

Short length enables placement in space-constrained designs, promoting greater flexibility in PCB layouts.

Maximum Switching Frequency: 133 kHz

A high switching frequency allows for smaller passive components, which aid in reducing overall PCB size.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and are ideal for automated assembly processes.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control delivers high efficiency and fine regulation of output voltage.

Switcher Config: SINGLE

Single switcher configuration simplifies design complexity, making it easier to implement.

Terminal Pitch: 1.27 mm

Standard terminal pitch ensures compatibility with common PCB designs, facilitating easier integration.

Minimum Input Voltage: 12 V

Supports a minimum input of 12V, providing flexibility for a range of applications.

Maximum Input Voltage: 30 V

A maximum input of 30V allows the product to handle a wide variety of voltage conditions, making it very adaptable.

Technical Specifications

Switching Regulators & Controllers TEA1733BT/N2,118 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

30 V

Minimum Input Voltage:

12 V

Nominal Input Voltage:

20 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

133 kHz

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TEA1733BT/N2,118 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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