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TEA1731TS/1,115

NXP Semiconductors

TEA1731TS/1,115 by NXP Semiconductors

TEA1731TS/1,115 by NXP Semiconductors is a compact switching regulator designed for efficient power management. It features a current-mode control, 6 terminals in a thin profile package, and supports peak reflow temps of 260 °C. Ideal for space-constrained applications requiring reliable voltage regulation.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,924 parts In-Stock

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4,924

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Vyrian

USA . 4,451 parts In-Stock

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4,451

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Anansix

USA . 910 parts In-Stock

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910

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Distributors (Availability)

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Microchip USA

USA . 178 parts In-Stock

1+ parts

$0.451

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178

$0.451

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One Stop Electronics

USA . 1,007 parts In-Stock

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$0.500

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1,007

$0.500

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AZTECH Wire

Italy . 352 parts In-Stock

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$15.620

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352

$15.620

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Component Stockers USA

USA . 290 parts In-Stock

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$99.990

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290

$99.990

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UNI Independent Distributors

Spain . 4,173 parts In-Stock

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Corphita

USA . 237 parts In-Stock

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237

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Overview

Unlock unparalleled efficiency and reliability with the TEA1731TS/1,115 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers a switching regulator that excels in performance across diverse applications—from power supplies to energy-efficient designs. Enjoy the benefits of reliable current-mode control in a compact format, making integration seamless and enhancing your product’s longevity while reducing energy costs. Choose NXP for innovation you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures excellent thermal and mechanical stability, making this regulator reliable for long-term operation.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling easier integration into small circuit boards and improving overall space efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs and allows for efficient routing of tracks.

No. of Terminals: 6

Having 6 terminals provides flexibility for connection options and additional functionalities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

A small outline and thin profile ensure low height, which is essential for applications where space is at a premium.

Control Mode: CURRENT-MODE

The current-mode control provides enhanced stability and transient response, ensuring smooth operation in varying load conditions.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances soldering and assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with most lead-free soldering processes, ensuring ease of manufacture.

Terminal Form: GULL WING

Gull wing terminals are designed for improved mechanical stability and ease of soldering, enhancing reliability in connections.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm allows for high density on PCBs while maintaining compatibility with existing soldering equipment.

Technical Specifications

Switching Regulators & Controllers TEA1731TS/1,115 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

TEA1731TS/1,115 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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