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TEA1703TS/N1,115

NXP Semiconductors

TEA1703TS/N1,115 by NXP Semiconductors

TEA1703TS/N1,115 by NXP Semiconductors is a compact voltage-mode switching regulator with a max output current of 25 mA and a switching frequency of 33 kHz. Its small outline, thin profile design makes it ideal for space-constrained applications. This surface-mount device features a peak reflow temp of 260 °C for efficient assembly.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,872 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

2,872

-

$0.515

$0.428

$0.381

Verical

USA . 2,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

2,872

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,276 parts In-Stock

1+ parts

$0.401

100+ parts

-

1k+ parts

-

10k+ parts

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4,276

$0.401

-

-

-

Vyrian

USA . 8,263 parts In-Stock

1+ parts

-

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8,263

-

-

-

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Anansix

USA . 834 parts In-Stock

1+ parts

-

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834

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 368 parts In-Stock

1+ parts

$0.380

100+ parts

-

1k+ parts

-

10k+ parts

-

368

$0.380

-

-

-

Microchip USA

USA . 3,253 parts In-Stock

1+ parts

$2.452

100+ parts

-

1k+ parts

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3,253

$2.452

-

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-

AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$10.830

100+ parts

-

1k+ parts

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10k+ parts

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777

$10.830

-

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QUARKTWIN TECHNOLOGY LTD

USA . 17,926 parts In-Stock

1+ parts

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100+ parts

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17,926

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UNI Independent Distributors

Spain . 4,777 parts In-Stock

1+ parts

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100+ parts

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4,777

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Overview

Unlock superior performance and efficiency with the TEA1703TS/N1,115 from NXP Semiconductors. Renowned for their innovation and reliability, NXP delivers a switching regulator that excels in compact designs without compromising on power. Ideal for automotive, industrial, and consumer applications, this sleek component ensures seamless voltage control, enhancing your product's longevity and reliability. Experience quality that drives your success today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

The surface mount capability allows for compact PCB designs and simplifies the manufacturing process, optimizing space and performance.

Package Shape: RECTANGULAR

The rectangular shape enhances the ease of handling and integration into different circuit layouts, contributing to efficient design.

No. of Terminals: 6

With 6 terminals, this product provides adequate connectivity options for a range of applications, supporting versatile configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design aid in minimizing the board area needed, perfect for space-constrained applications.

Control Mode: VOLTAGE-MODE

The voltage-mode control offers stable performance and ease of implementation, making it suitable for many switching regulator applications.

Terminal Position: DUAL

Dual terminal positioning enhances the layout flexibility and supports better thermal management, leading to improved performance.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C indicates compatibility with modern soldering processes, ensuring quality and reliability during manufacturing.

Maximum Switching Frequency: 33 kHz

The maximum switching frequency of 33 kHz allows for efficient energy conversion, suitable for a wide range of power management applications.

Maximum Output Current: 0.025 A

Supporting a maximum output current of 0.025 A makes this product ideal for low-power applications, ensuring energy efficiency.

Terminal Form: GULL WING

Gull wing terminals allow for reliable solder connections and facilitate ease of assembly, which is crucial in high-volume production.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch is suitable for modern PCB designs, enabling high-density layouts while maintaining consistent performance.

Technical Specifications

Switching Regulators & Controllers TEA1703TS/N1,115 attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

R-PDSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Output Current:

.025 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

33 kHz

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trade Compliance

TEA1703TS/N1,115 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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