Loading...

TDA9989ET/C1,518

NXP Semiconductors

TDA9989ET/C1,518 by NXP Semiconductors

TDA9989ET/C1,518 by NXP Semiconductors is a consumer IC designed for high-performance applications. It operates at 1.2/1.8V with a max temp of 85 °C and features a fine pitch grid array with 64 terminals. Ideal for compact electronic devices, it ensures reliable performance in various environments.

Median Price

$2.152

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 56,831 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

56,831

-

$2.030

$1.820

$1.710

Verical

USA . 56,831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.275

10k+ parts

$2.138

56,831

-

-

$2.275

$2.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 257 parts In-Stock

1+ parts

$2.147

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$2.147

-

-

-

Vyrian

USA . 7,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,089

-

-

-

-

Anansix

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,015

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,475 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

-

3,475

$2.034

-

-

-

Microchip USA

USA . 329 parts In-Stock

1+ parts

$3.252

100+ parts

-

1k+ parts

-

10k+ parts

-

329

$3.252

-

-

-

AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$22.090

100+ parts

-

1k+ parts

-

10k+ parts

-

710

$22.090

-

-

-

UNI Independent Distributors

Spain . 1,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,678

-

-

-

-

Overview

Elevate your consumer electronics with the TDA9989ET/C1,518 from NXP Semiconductors—where quality meets innovation. Designed for exceptional performance in audio and video applications, this cutting-edge IC enhances user experiences while ensuring reliability across varied conditions. With NXP’s renowned expertise, you gain not just a product, but a partner in delivering superior technology that drives value and satisfaction for your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental stress, making it a reliable choice for consumer applications.

Surface Mount: YES

Being surface mount compatible allows for compact designs and easy integration into modern electronics, enhancing the product's versatility.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, facilitating efficient layouts and reducing manufacturing costs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the unique performance and functionality requirements of consumer electronics.

Power Supplies (V): 1.2/1.8, 1.8

Support for low voltage power supplies allows for energy-efficient operation, contributing to longer battery life in portable devices.

No. of Terminals: 64

With 64 terminals, this IC provides ample connectivity options, enabling complex functionality while maintaining a manageable size.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array package style with fine pitch allows for higher terminal density, improving performance in high-speed applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in a wide range of environmental conditions, essential for consumer electronics.

Minimum Operating Temperature: -20 °C

The ability to operate at a minimum temperature of -20 °C guarantees functionality even in colder environments, increasing its application range.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better thermal management and allows integration into space-constrained designs.

Terminal Form: BALL

Ball terminal form ensures robust mechanical connections and enhances soldering reliability, critical for long-term device performance.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for compact designs without sacrificing connectivity, ideal for modern, space-efficient electronic devices.

Technical Specifications

Other Function Consumer ICs TDA9989ET/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2/1.8,1.8

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

TDA9989ET/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20