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TDA9809M/V1,118

NXP Semiconductors

TDA9809M/V1,118 by NXP Semiconductors

Limited Part Number Data;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,709

-

-

-

-

Digiode

USA . 3,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,668

-

-

-

-

Anansix

USA . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

238

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 618 parts In-Stock

1+ parts

$17.140

100+ parts

-

1k+ parts

-

10k+ parts

-

618

$17.140

-

-

-

One Stop Electronics

USA . 1,591 parts In-Stock

1+ parts

$72.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,591

$72.100

-

-

-

UNI Independent Distributors

Spain . 6,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,662

-

-

-

-

Corphita

USA . 557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

557

-

-

-

-

Technical Specifications

Additional Parts TDA9809M/V1,118 attributes and parameters. Explore more Additional Parts devices from NXP Semiconductors

Technical Specifications

Other Names:

TDA9809MDB-T
935228080118
TDA9809MDB-T-ND

Function:

Demodulator, IF-PLL

Category:

RF and Wireless
RF Demodulators

Package / Case:

20-SSOP (0.209", 5.30mm Width)

Voltage - Supply:

4.5V ~ 5.5V

Packaging:

Tape & Reel (TR)

Current - Supply:

102 mA

Mounting Type:

Surface Mount

Supplier Device Package:

20-SSOP

Standard Package:

1,000

Base Product Number:

TDA980

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TDA9809M/V1,118 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Authentic purchasing experiences

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