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TDA8579TD-T

NXP Semiconductors

TDA8579TD-T by NXP Semiconductors

TDA8579TD-T by NXP Semiconductors is a line receiver with 8 terminals, operating b/w 5-18V. It has a small outline package, Gull Wing terminal form, and differential input characteristics. Ideal for applications requiring a 2-bit receiver with no receive delay, such as automotive electronics or industrial control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,894 parts In-Stock

1+ parts

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2,894

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Digiode

USA . 2,269 parts In-Stock

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2,269

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Vyrian

USA . 1,422 parts In-Stock

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1,422

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 265 parts In-Stock

1+ parts

$14.673

100+ parts

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265

$14.673

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One Stop Electronics

USA . 324 parts In-Stock

1+ parts

$29.500

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324

$29.500

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Ampacity Inc.

Singapore . 1,626 parts In-Stock

1+ parts

$47.500

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1,626

$47.500

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UNI Independent Distributors

Spain . 2,837 parts In-Stock

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2,837

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Corphita

USA . 1,621 parts In-Stock

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1,621

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Bastille Electronics

Australia . 90 parts In-Stock

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90

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Overview

Enhance your audio experience with the TDA8579TD-T by NXP Semiconductors, a top-quality line driver and receiver that delivers exceptional performance and reliability. Manufactured by industry leader NXP Semiconductors, this product offers unparalleled value and benefits for a wide range of applications. With its compact design and advanced features, the TDA8579TD-T is the perfect choice for customers looking to elevate their audio systems to the next level. Unlock the full potential of your audio devices with the TDA8579TD-T today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this product is suitable for a wide range of applications and can handle higher power requirements.

Package Shape: RECTANGULAR

The rectangular shape of the package offers efficient use of board space and easy integration into existing designs.

No. of Terminals: 8

The ample number of terminals provides flexibility in connecting to various components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving board space and enables compact designs.

Minimum Supply Voltage: 5 V

The low minimum supply voltage makes this product energy efficient and suitable for low power applications.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connectivity options.

Maximum Seated Height: 1.75 mm

The low profile design with a maximum seated height of 1.75 mm enables compact and streamlined product layouts.

Width: 3.9 mm

The narrow width of 3.9 mm helps in saving space on the circuit board and allows for denser packaging of components.

Technical Specifications

Line Drivers & Receivers TDA8579TD-T attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

8.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

TDA8579TD-T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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