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TDA8444P

NXP Semiconductors

TDA8444P by NXP Semiconductors

D/A CONVERTER; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$4.190

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 209 parts In-Stock

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$4.190

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DF Sales Co.

USA . 209 parts In-Stock

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$4.190

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Vyrian

USA . 3,662 parts In-Stock

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Digiode

USA . 3,085 parts In-Stock

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Anansix

USA . 2,466 parts In-Stock

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R&J Components

USA . 807 parts In-Stock

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807

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Q Components

USA . 457 parts In-Stock

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ComSIT Distribution GmbH

Germany . 282 parts In-Stock

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Odi Ramu Company

Canada . 115 parts In-Stock

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Resion

USA . 106 parts In-Stock

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Prism Electronics

USA . 86 parts In-Stock

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Pegasus Components GmbH

Germany . 60 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 49 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 45 parts In-Stock

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A&K Electronics

USA . 21 parts In-Stock

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Rotakorn

Sweden . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 18 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 9 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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A2Z Electronics, Inc.

USA . 4 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Halfin

Belgium . 2 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,504 parts In-Stock

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$10.000

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,954 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 325 parts In-Stock

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Metaverse IC Inc.

Canada . 278 parts In-Stock

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UNI Independent Distributors

Spain . 276 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 49 parts In-Stock

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Assy Fe

Spain . 35 parts In-Stock

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Technical Specifications

Digital-to-Analog Converters TDA8444P attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

15 mA

No. of Bits:

6

No. of Functions:

8

Electrical Specifications

Nominal Supply Voltage:

12 V

Minimum Analog Output Voltage:

.8 V

Maximum Analog Output Voltage:

10 V

Operating Conditions

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Maximum Time At Peak Reflow Temperature:

40 s

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.85 in (21.6 mm)

Maximum Seated Height:

0.185 in (4.7 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-P16

Trade Compliance

TDA8444P Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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