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TDA8444

NXP Semiconductors

TDA8444 by NXP Semiconductors

D/A CONVERTER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$6.351

Lifecycle Status

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18

In-Stock Inventory

1k+

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Freelance Electronics

USA . 10 parts In-Stock

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$4.082

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$4.286

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American Microsemiconductor Inc.

USA . 3 parts In-Stock

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Vyrian

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Anansix

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Digiode

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LIBRA Elektronik GmbH

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ACDS - Activité Composants Distribution Service

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Fibra_Brandt Electronic GMBH

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Mil-Aero Solutions, Inc.

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Electronics Depot

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ECAB

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LittleDiode

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Prism Electronics

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Goldney Electronics S.L.

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Corel Iberica Componentes, S.L.

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USA . 250 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Technical Specifications

Digital-to-Analog Converters TDA8444 attributes and parameters. Explore more Digital-to-Analog Converters devices from NXP Semiconductors

Converter Specifications

Technology:

Bipolar

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

1.6 %

Maximum Supply Current:

15 mA

No. of Bits:

6

No. of Functions:

8

Electrical Specifications

Nominal Supply Voltage:

12 V

Minimum Analog Output Voltage:

.1 V

Maximum Analog Output Voltage:

11.5 V

Power Supplies:

12 V

Operating Conditions

Minimum Operating Temperature:

-20 °C (-4 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.85 in (21.6 mm)

Maximum Seated Height:

0.185 in (4.7 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T16

Trade Compliance

TDA8444 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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