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TDA1060B

NXP Semiconductors

TDA1060B by NXP Semiconductors

SWITCHING CONTROLLER; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

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Lifecycle Status

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In-Stock Inventory

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Vyrian

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Digiode

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Anansix

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MRC Electronics

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Pegasus Components GmbH

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ComSIT Distribution GmbH

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ECAB

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Fibra_Brandt Electronic GMBH

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One Stop Electronics

USA . 1,313 parts In-Stock

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UNI Independent Distributors

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Corphita

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Perfect Parts

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Technical Specifications

Switching Regulators & Controllers TDA1060B attributes and parameters. Explore more Switching Regulators & Controllers devices from NXP Semiconductors

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

29.5 V

Minimum Input Voltage:

19 V

Nominal Input Voltage:

24 V

JESD-30 Code:

R-CDIP-T16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.2 A

Nominal Output Voltage:

8.4 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

100 kHz

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

TDA1060B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-12-321-8441, 5962123218441

NIIN

123218441

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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