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SAA3004P

NXP Semiconductors

SAA3004P by NXP Semiconductors

TRANSMITTER IC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Digiode

USA . 2,978 parts In-Stock

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Anansix

USA . 1,746 parts In-Stock

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Vyrian

USA . 841 parts In-Stock

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Freddi Giovanni

Italy . 230 parts In-Stock

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GES GmbH

Germany . 119 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 114 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 46 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 12 parts In-Stock

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LittleDiode

UK . 10 parts In-Stock

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ECAB

Sweden . 10 parts In-Stock

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Huijzer Components

Netherlands . 10 parts In-Stock

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Goldney Electronics S.L.

Spain . 5 parts In-Stock

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PC Components Company LLC

USA . 5 parts In-Stock

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Bristol Electronics

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Inland Empire Components Inc.

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EMSNET

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One Stop Electronics

USA . 1,228 parts In-Stock

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UNI Independent Distributors

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Assy Fe

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Corphita

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 18 parts In-Stock

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Technical Specifications

Remote Control ICs SAA3004P attributes and parameters. Explore more Remote Control ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

11 V

Minimum Supply Voltage (Vsup):

4 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

SAA3004P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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