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SA676DK/01

NXP Semiconductors

SA676DK/01 by NXP Semiconductors

SA676DK/01 by NXP Semiconductors is a compact audio single-chip receiver IC designed for surface mount applications. It features 20 terminals in a small outline package, utilizing plastic/epoxy materials. Ideal for enhancing audio systems, it ensures efficient signal processing and integration.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Chip Stock

USA . 4,160 parts In-Stock

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Connect4Technologies Inc.

Canada . 1,779 parts In-Stock

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Anansix

USA . 1,459 parts In-Stock

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Vyrian

USA . 932 parts In-Stock

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932

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ComSIT Distribution GmbH

Germany . 475 parts In-Stock

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475

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Digiode

USA . 111 parts In-Stock

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111

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One Stop Electronics

USA . 269 parts In-Stock

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$8.800

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269

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 3,793 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 1,623 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Unlock unparalleled audio performance with the SA676DK/01 from NXP Semiconductors, a leader in innovation and quality. This compact receiver IC delivers exceptional sound clarity while seamlessly integrating into your designs, making it perfect for consumer electronics, automotive, or IoT applications. NXP's commitment to reliability ensures you get maximum value, enabling you to elevate your products with enhanced functionality and superior user experiences.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring the reliability of the receiver IC in various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration onto printed circuit boards, reducing assembly time and enabling compact design.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single chip receiver, this IC simplifies audio signal processing and enhances performance by minimizing the number of discrete components needed.

No. of Terminals: 20

Having 20 terminals offers ample connectivity options for a variety of applications, making it versatile for different design requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables space-saving designs, making it suitable for applications where PCB real estate is limited.

Terminal Position: DUAL

With dual terminal positioning, this IC allows for better layout flexibility on PCBs, improving the overall design and performance.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint integrity and provides better mechanical stability, contributing to longer-lasting performance in devices.

Technical Specifications

Receiver ICs SA676DK/01 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SA676DK/01 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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