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SA5234N/01,112

NXP Semiconductors

SA5234N/01,112 by NXP Semiconductors

OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,653 parts In-Stock

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2,653

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Anansix

USA . 2,563 parts In-Stock

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2,563

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Digiode

USA . 108 parts In-Stock

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108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 963 parts In-Stock

1+ parts

$2.410

100+ parts

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963

$2.410

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AZTECH Wire

Italy . 839 parts In-Stock

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$19.000

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839

$19.000

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Component Stockers USA

USA . 222 parts In-Stock

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$99.990

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222

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,747 parts In-Stock

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27,747

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UNI Independent Distributors

Spain . 6,341 parts In-Stock

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Microchip USA

USA . 5,260 parts In-Stock

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Corphita

USA . 1,439 parts In-Stock

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1,439

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Technical Specifications

Operational Amplifiers (Op Amps) SA5234N/01,112 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1/±2.75/2/5.5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

31620

Minimum Slew Rate:

0.5 V/us

Nominal Slew Rate:

0.8 V/us

Maximum Bias Current (IIB) @25 °C:

75 nA

Operational Characteristics

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

4.8 mA

Physical Characteristics

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

SA5234N/01,112 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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