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SA5219D,602

NXP Semiconductors

SA5219D,602 by NXP Semiconductors

WIDE BAND LOW POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e4;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,124 parts In-Stock

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6,124

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Digiode

USA . 4,111 parts In-Stock

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4,111

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Anansix

USA . 769 parts In-Stock

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769

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$2.187

100+ parts

$1.990

1k+ parts

$1.793

10k+ parts

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900

$2.187

$1.990

$1.793

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Microchip USA

USA . 457 parts In-Stock

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$2.692

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457

$2.692

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AZTECH Wire

Italy . 52 parts In-Stock

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$20.900

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52

$20.900

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One Stop Electronics

USA . 899 parts In-Stock

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$36.000

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899

$36.000

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Component Stockers USA

USA . 301 parts In-Stock

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$99.990

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301

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Corphita

USA . 2,081 parts In-Stock

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2,081

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UNI Independent Distributors

Spain . 1,079 parts In-Stock

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Technical Specifications

RF & Microwave Amplifiers SA5219D,602 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

16

Maximum Operating Frequency:

700 MHz

Minimum Operating Frequency:

0 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOP16,.25

Power Supplies (V):

5

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

50 mA

Technology:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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