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S9S08DZ48F2MLH

NXP Semiconductors

S9S08DZ48F2MLH by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: TIN;

Median Price

$6.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

$6.330

1k+ parts

$5.660

10k+ parts

$5.330

16,000

-

$6.330

$5.660

$5.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,995 parts In-Stock

1+ parts

$6.678

100+ parts

-

1k+ parts

-

10k+ parts

-

1,995

$6.678

-

-

-

Vyrian

USA . 8,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,216

-

-

-

-

Anansix

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,200 parts In-Stock

1+ parts

$5.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,200

$5.640

-

-

-

Corphita

USA . 306 parts In-Stock

1+ parts

$6.327

100+ parts

-

1k+ parts

-

10k+ parts

-

306

$6.327

-

-

-

Component Stockers USA

USA . 18,747 parts In-Stock

1+ parts

$8.710

100+ parts

$8.190

1k+ parts

$7.400

10k+ parts

$7.400

18,747

$8.710

$8.190

$7.400

$7.400

AZTECH Wire

Italy . 184 parts In-Stock

1+ parts

$13.280

100+ parts

-

1k+ parts

-

10k+ parts

-

184

$13.280

-

-

-

Microchip USA

USA . 2,404 parts In-Stock

1+ parts

$24.107

100+ parts

-

1k+ parts

-

10k+ parts

-

2,404

$24.107

-

-

-

A-Z Elektronik GmbH

Germany . 4,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,200

-

-

-

-

UNI Independent Distributors

Spain . 2,357 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,357

-

-

-

-

Technical Specifications

Microcontrollers S9S08DZ48F2MLH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

HCS08

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of I/O Lines:

54

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

3072

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

1536

Connectivity:

CAN, IIC, SCI(2), SPI

Peripherals:

ANALOG COMPARATOR(2), POR, PWM, RTC, TIMER(2), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

S9S08DZ48F2MLH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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